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pro vyhledávání: '"S. SCHAMM"'
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Akademický článek
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Publikováno v:
Electron Microscopy and Analysis 1997 ISBN: 9781003063056
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c370d53edb876fe03190cb9d1d16662c
https://doi.org/10.1201/9781003063056-86
https://doi.org/10.1201/9781003063056-86
Autor:
I.N. Antonov, A.I. Belov, C. Bonafos, S. Brivio, Laurent Cario, M. Carrada, Brigitte Caussat, Georgios Ch. Sirakoulis, Dennis Valbjørn Christensen, Elena Cianci, Benoit Corraze, V.A. Demin, P. Dimitrakis, A.V. Emelyanov, Manuel Escudero, Vincenzo Esposito, D.O. Filatov, Georgios Giannopoulos, O.N. Gorshkov, F. Gourbilleau, E.G. Gryaznov, D.V. Guseinov, Michael Hoffmann, Etienne Janod, Andreas Kaidatzis, L. Khomenkhova, D.S. Korolev, M.N. Koryazhkina, Yang Li, Qi Liu, Benjamin Max, A.N. Mikhaylov, Thomas Mikolajick, Halid Mulaosmanovic, Dimitris Niarchos, K.E. Nikiruy, P. Normand, E.V. Okulich, V.I. Okulich, D.A. Pavlov, Nini Pryds, Krishnaswamy Ramkumar, Antonio Rubio, V.V. Rylkov, Simone Sanna, S. Schamm-Chardon, Uwe Schroeder, M.E. Shenina, R.A. Shuisky, K.V. Sidorenko, A. Slaoui, Stefan Slesazeck, B. Spagnolo, Sabina Spiga, E. Talbot, Stefan Tappertzhofen, D.I. Tetelbaum, S.V. Tikhov, Julien Tranchant, Constantin Vahlas, E. Vianello, Ioannis Vourkas, Xiaolong Zhao
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6c5caf76373ac55685791efd20e3e43
https://doi.org/10.1016/b978-0-12-814629-3.09989-x
https://doi.org/10.1016/b978-0-12-814629-3.09989-x
Akademický článek
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Autor:
S. Schamm-Chardon, Pierre-Eugène Coulon, S. Baldovino, Marco Fanciulli, Luca Lamagna, Claudia Wiemer
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2011, 88 (4), pp.419-422. ⟨10.1016/j.mee.2010.10.012⟩
Microelectronic Engineering, 2011, 88 (4), pp.419-422. ⟨10.1016/j.mee.2010.10.012⟩
Microelectronic engineering 88 (2011): 419–422.
info:cnr-pdr/source/autori:Schamm-Chardon S, Coulon PE, Lamagna L, Wiemer C, Baldovino S, Fanciulli M/titolo:Combining HRTEM-EELS nano-analysis with capacitance-voltage measurements to evaluate high-kappa thin films deposited on Si and Ge as candidate for future gate dielectrics/doi:/rivista:Microelectronic engineering/anno:2011/pagina_da:419/pagina_a:422/intervallo_pagine:419–422/volume:88
Microelectronic Engineering, Elsevier, 2011, 88 (4), pp.419-422. ⟨10.1016/j.mee.2010.10.012⟩
Microelectronic Engineering, 2011, 88 (4), pp.419-422. ⟨10.1016/j.mee.2010.10.012⟩
Microelectronic engineering 88 (2011): 419–422.
info:cnr-pdr/source/autori:Schamm-Chardon S, Coulon PE, Lamagna L, Wiemer C, Baldovino S, Fanciulli M/titolo:Combining HRTEM-EELS nano-analysis with capacitance-voltage measurements to evaluate high-kappa thin films deposited on Si and Ge as candidate for future gate dielectrics/doi:/rivista:Microelectronic engineering/anno:2011/pagina_da:419/pagina_a:422/intervallo_pagine:419–422/volume:88
Aberration corrected transmission electron microscopy and electron spectroscopy are combined with electrical measurements for the quantitative description of the structural, chemical and dielectric parameters of rare earth/transition metal oxides thi
Autor:
Corinne Legros, Karolina Galicka-Fau, Magali Brunet, Isabelle Gallet, M. Andrieux, S. Schamm, Michaële Herbst, Emmanuel Scheid
Publikováno v:
Microelectronic Engineering. 86:2034-2037
This work deals with high-density integrated capacitors for output filters in future micro DC-DC converters. To reach high capacitance density, 3D structures were created in silicon with DRIE followed by MOCVD of ZrO"2 (100nm thick). The step coverag
Autor:
A. Mouti, Bernd Schmidt, Pascal Normand, S. Schamm, G. Ben Assayag, V. Ioannou-Sougleridis, Panagiotis Dimitrakis, Caroline Bonafos, Jill Becker
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2009, 86 (7-9), pp.1838-1841. 〈10.1016/j.mee.2009.03.074〉
Microelectronic Engineering, Elsevier, 2009, 86 (7-9), pp.1838-1841. ⟨10.1016/j.mee.2009.03.074⟩
Microelectronic Engineering, 2009, 86 (7-9), pp.1838-1841. ⟨10.1016/j.mee.2009.03.074⟩
Microelectronic Engineering, Elsevier, 2009, 86 (7-9), pp.1838-1841. 〈10.1016/j.mee.2009.03.074〉
Microelectronic Engineering, Elsevier, 2009, 86 (7-9), pp.1838-1841. ⟨10.1016/j.mee.2009.03.074⟩
Microelectronic Engineering, 2009, 86 (7-9), pp.1838-1841. ⟨10.1016/j.mee.2009.03.074⟩
International audience; Structural and electrical properties of ALD-grown 5 and 7 nm-thick Al2O3 layers before and after implantation of Ge ions (1 keV, 0.5–1 × 1016 cm−2) and thermal annealing at temperatures in the 700–1050 °C range are rep
Autor:
Laurence Ressier, Gérard Benassayag, Jérémie Grisolia, Pascal Normand, S. Schamm, Arnaud Arbouet, C. Dumas, Vincent Paillard
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2008, 85 (12), pp.2358-2361. ⟨10.1016/j.mee.2008.09.027⟩
Microelectronic Engineering, 2008, 85 (12), pp.2358-2361. ⟨10.1016/j.mee.2008.09.027⟩
Microelectronic Engineering, Elsevier, 2008, 85 (12), pp.2358-2361. ⟨10.1016/j.mee.2008.09.027⟩
Microelectronic Engineering, 2008, 85 (12), pp.2358-2361. ⟨10.1016/j.mee.2008.09.027⟩
International audience; Charge retention of Si nanocrystals elaborated by ultra-low energy ion implantation and thermal annealings into a thin SiO2 layer is characterized by atomic force microscopy (AFM) and Kelvin force microscopy (KFM). Electrons a
Autor:
Luca Lamagna, L. H. Lu, Dimitra Tsoutsou, S. Schamm, Pierre-Eugène Coulon, Giovanna Scarel, Marco Fanciulli, Shu Miao, Stelios N. Volkos, Claudia Wiemer
Publikováno v:
ECS Transactions. 13:77-88
Atomic Layer Deposition (ALD) has gained increasing attention for the sub-nm growth of high permittivity (k) rare earth oxide films. State of the art device operation heavily depends on the oxide/semiconductor interface properties. In this work, we a