Zobrazeno 1 - 10
of 10
pro vyhledávání: '"S. R. Summerfelt"'
Autor:
S. R. Summerfelt, R. Bailey, P. Staubs, J. Rodriguez, K. Boku, Theodore S. Moise, M. Arendt, Gregory B. Shinn, K. Remack, J. Eliason, K. R. Udayakumar
Publikováno v:
Japanese Journal of Applied Physics. 47:2710-2713
Enhanced yield and reliability through process improvements, leading to a manufacturable process for a full-bit functional 8 Mbit one transitor–one capacitor (1T–1C) embedded ferroelectric random access memory (eFRAM) fabricated within a low-leak
Autor:
Yaw S. Obeng, Gregory B. Shinn, G. R. Fox, Theodore S. Moise, J. S. Martin, A. McKerrow, J. Gertas, S. R. Summerfelt, K. R. Udayakumar, J. Eliason, J. Rodriguez, R. Bailey, A. Haider, K. Remack, K. Boku
Publikováno v:
Japanese Journal of Applied Physics. 46:2180-2183
We report the electrical properties of a full-bit functional 8 Mbit one transitor–one capacitor (1T–1C) embedded ferroelectric random access memory (eFRAM) fabricated within a low-leakage 130 nm 5 lm Cu interconnect complementary metal oxide semi
Autor:
S. R. Summerfelt, Theodore S. Moise, K. R. Udayakumar, Sanjeev Aggarwal, Hugh P. McAdams, B. Rathsack, Francis G. Celii, J. Rodriguez, Lindsey H. Hall, L. Matz, J. S. Martin, K. Remack, K. Boku
Publikováno v:
Japanese Journal of Applied Physics. 45:3202-3206
High density embedded ferroelectric random access memory (FRAM), operable at 1.5 V, has been fabricated within a 130 nm, 5 lm Cu/fluorosilicate glass (FSG) logic process. To evaluate FRAM extendability to future process nodes, we have measured the bi
Publikováno v:
Journal of Microscopy. 179:77-89
SUMMARY The possibility of imaging NiFe2O4 spinel particles, with a dimension of only 1–3 nm, which are embedded in an NiO matrix has been examined. Computer image simulation studies based on the multislice method and complete, atomistic models of
Autor:
Gregory B. Shinn, R. Bailey, Theodore S. Moise, J. Rodriguez, K. Remack, S. R. Summerfelt, K. Boku, M. Arendt, P. Staubs, J. Eliason, J. Gertas, K. R. Udayakumar
Publikováno v:
Extended Abstracts of the 2007 International Conference on Solid State Devices and Materials.
Autor:
B. Khan, Glen R. Fox, J. Rodriguez, J. Groat, A. Haider, R. Bailey, N. Schauer, Sudhir K. Madan, K. Remack, K. R. Udayakumar, Yaw S. Obeng, K. Boku, A. McKerrow, G. Albrecht, J. S. Martin, Gregory B. Shinn, E. Jabillo, J. Walbert, S. R. Summerfelt, Theodore S. Moise, Hugh P. McAdams, Sanjeev Aggarwal, D. Anderson, J. Gertas, Francis G. Celii, J. Eliason
Publikováno v:
Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials.
Autor:
Theodore S. Moise, L. Matz, B. Rathsack, Hugh P. McAdams, J. Rodriguez, K. Boku, S. R. Summerfelt, Francis G. Celii, Sanjeev Aggarwal, Lindsey H. Hall, K. R. Udayakumar, J. S. Martin, K. Remack
Publikováno v:
Extended Abstracts of the 2005 International Conference on Solid State Devices and Materials.
Autor:
Stephen T. Johnston, Daniel J. Vestyck, Jun Amano, Stephen R. Gilbert, Luigi Colombo, Rahim Kavari, G. Xing, S. R. Summerfelt, M. W. Russell, Alvin Leng Sun Loke, Tomoyuki Sakoda, S. M. Bilodeau, Theodore S. Moise, T. Hsu, L. A. Wills, S. Ma
Publikováno v:
International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318).
Summary form only given. High-density, embedded ferroelectric memory (FeRAM) has the potential to replace embedded flash, embedded DRAM, and non-cache SRAM and could be a key enabler for future system-on-a-chip applications. Despite this appeal, the
Autor:
Rahim Kavari, Luigi Colombo, S. Ma, Stephen R. Gilbert, J. Amano, S. R. Summerfelt, L. A. Wills, Alvin Leng Sun Loke, Tomoyuki Sakoda, G. Xing, Theodore S. Moise
Publikováno v:
Extended Abstracts of the 2000 International Conference on Solid State Devices and Materials.
Publikováno v:
Science and Technology of Electroceramic Thin Films ISBN: 9789048145140
Science and Technology of Electroceramic Thin Films
Science and Technology of Electroceramic Thin Films
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43b86c6ee851e0ad072ce237b1fae9c3
https://doi.org/10.1007/978-94-017-2950-5_27
https://doi.org/10.1007/978-94-017-2950-5_27