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pro vyhledávání: '"S. Pekin"'
Akademický článek
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Autor:
Bhavani P. Dewan-Sandur, Terry Dishongh, S. Pekin, Yongje Lee, Dereje Agonafer, Abhijit Kaisare, M.M. Hossain
Publikováno v:
Heat Transfer Engineering. 29:134-148
The convergence of computing and communications dictates building up rather than out. As consumers demand more functionality in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72443b9ed5f9c4eb41d0f17f71dad3ca
https://doi.org/10.1080/01457630701673170
https://doi.org/10.1080/01457630701673170
Publikováno v:
Acta Obstetricia et Gynecologica Scandinavica. 79:604-607
There is still no cost-effective endometrial screening method for asymptomatic postmenopausal breast cancer patients using tamoxifen. We investigated the effectivity of transvaginal ultrasonography and endometrial sampling as a screening method for a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f9ba9cdd4050323998a5c6813fca70ea
https://doi.org/10.1080/j.1600-0412.2000.079007604.x
https://doi.org/10.1080/j.1600-0412.2000.079007604.x
Autor:
Sadika Al Awadi, Z. U. Khan, Elena Samilchuk, George Cherian, J.G. Patel, Brendan D’Souza, Eiman Mokaddas, Mahmoud A.E. Wahby, Malak Hashad, Farid Shehadeh, Moheb M. Henein, A.A. Al Anzi, Nasser J. Hayat, K.P. Dawson, S. Pekin, Abdullahi Fido, R. Shawis, Sameer M. Humad, N. Khan, S.C. Sanyal, A.R.D. Lulu, Geeti Chadhi, B.S. Ghazala, Milica Mavra, B. Uthaman, Z. Kavak, A.L. Salama, N. Ceyhan, Shuhaiber Hj, T.A. Junaid
Publikováno v:
Medical Principles and Practice. 5:I-IV
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccdb9a84706b6b623b4ce02efcd0f994
https://doi.org/10.1159/000157403
https://doi.org/10.1159/000157403
Publikováno v:
Medical Principles and Practice. 5:187-191
In this article, we evaluate the value of the combined use of vaginal sonography and endometrial sampling for the diagnosis of endometrial disease in postmenopausal women. Fifty-three postmenopausal w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3184bea055a60b58e80d03bc416d305
https://doi.org/10.1159/000157404
https://doi.org/10.1159/000157404
Publikováno v:
2008 58th Electronic Components and Technology Conference.
The advancement in flip chip technology has enabled us to meet the requirement of smaller die size along with the increased functionality. Due to this development in flip chip packaging technology along with higher current carrying requirement of sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2d32fd7f85c7987ec1ccf45137ea251
https://doi.org/10.1109/ectc.2008.4549994
https://doi.org/10.1109/ectc.2008.4549994
Publikováno v:
Volume 11: Micro and Nano Systems, Parts A and B.
As there is continuous demand for miniaturization of electronic devices, flip chip technology is predominantly used for high density packaging. The technology offers several advantages like excellent electrical performance and better heat dissipation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cebc9c32cce790bad8f73b3fd7c7def8
https://doi.org/10.1115/imece2007-43766
https://doi.org/10.1115/imece2007-43766
Autor:
S. Pekin, Da. Agonafer, De. Agonafer, Terry Dishongh, C. Amon, B.P. Dewan-Sandur, Abhijit Kaisare
Publikováno v:
56th Electronic Components and Technology Conference 2006.
The convergence of computing and communications dictates building up rather than out. As consumers demand more functions in their hand-held devices, the need for more memory in a limited space is increasing, and integrating various functions into the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57627b4657fc0d2751b18ed90ec625be
https://doi.org/10.1109/ectc.2006.1645929
https://doi.org/10.1109/ectc.2006.1645929
Publikováno v:
Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.
Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant for stack die configuration and leads to study the effect of combined thermo-mechanical and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a9c33c56a86fa402903c858dc3e2fd0
https://doi.org/10.1109/stherm.2006.1625232
https://doi.org/10.1109/stherm.2006.1625232
Publikováno v:
Journal of experimentalclinical cancer research : CR. 23(1)
Our aim was to compare the results of bcl-2 expression in endometrial carcinoma with clinicopathological prognostic factors along with p53 accumulation. In addition, p53 expression was compared to different subtypes of endometrial carcinoma. Immunohi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::2483d9b3149e47eed24bf76cecfa5d8c
https://pubmed.ncbi.nlm.nih.gov/15149157
https://pubmed.ncbi.nlm.nih.gov/15149157