Zobrazeno 1 - 8
of 8
pro vyhledávání: '"S. N. Mathaudhu"'
Autor:
C. Kale, M. Rajagopalan, S. Turnage, B. Hornbuckle, K. Darling, S. N. Mathaudhu, K. N. Solanki
Publikováno v:
Materials Research Letters, Vol 6, Iss 2, Pp 152-158 (2018)
The presence of complex states-of-stress and strain-rates directly influence the dominant deformation mechanisms operating in a given material under load. Mg alloys have shown limited ambient temperature formability due to the paucity of active slip-
Externí odkaz:
https://doaj.org/article/5262c2310db842a2bbf60cd92384fa78
Autor:
W. W. Jian, G. M. Cheng, W. Z. Xu, H. Yuan, M. H. Tsai, Q. D. Wang, C. C. Koch, Y. T. Zhu, S. N. Mathaudhu
Publikováno v:
Materials Research Letters. 1:61-66
Mg alloys are among the lightest alloys but they are usually weak. Here we report a new mechanism to make them ultrastrong while maintaining good ductility. Stacking faults with nanoscale spacing were introduced into a Mg–8.5Gd–2.3Y–1.8Ag–0.4
Autor:
S. N. Mathaudhu, Derek H. Warner
Publikováno v:
Journal of Engineering Mechanics. 137:691-698
This work examines the influence of microcracking on a material’s tendency to shear localize under compressive loading. A two-dimensional (2D) finite-element framework with explicit crack representation using cohesive-element methodologies is emplo
Publikováno v:
Magnesium Technology 2012 ISBN: 9783319485713
Magnesium Technology 2012
Magnesium Technology 2012
Notably the most dominant twinning mode in hexagonal close-packed metals, {1012} twinning presents abnormal properties such as reversible twinning and non-Schmid effect. The twin boundaries may significantly deviate from the {1012} twinning plane. HC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b87c3f597bd38ab691414cdfa3d4c70e
https://doi.org/10.1007/978-3-319-48203-3_20
https://doi.org/10.1007/978-3-319-48203-3_20
Autor:
K. T. Hartwig, S. Balachandran, S. N. Mathaudhu, R. E. Barber, T. Pyon, R. B. Griffin, U. (Balu) Balachandran, Kathleen Amm, David Evans, Eric Gregory, Peter Lee, Mike Osofsky, Sastry Pamidi, Chan Park, Judy Wu, Mike Sumption
Publikováno v:
AIP Conference Proceedings.
Poor deformation behavior of tantalum (Ta) sheet used for tin diffusion barriers in Nb3Sn composite superconductors can lead to Ta layer rupture and even strand fracture during wire drawing. These problems arise because the Ta layer deforms nonunifor
Publikováno v:
AIP Conference Proceedings.
This report presents preliminary results of a project with the aim to fabricate fine‐grained tantalum sheet having a uniform microstructure that co‐deforms well with pure copper for superconductor diffusion barrier applications. Multi‐pass equa
Publikováno v:
AIP Conference Proceedings.
Large grained pure niobium was processed by multi‐pass equal channel angular extrusion and then annealed with the objective of producing a fine‐grained uniform recrystallized microstructure. Extrusions were performed on 25 mm square cross‐secti