Zobrazeno 1 - 1
of 1
pro vyhledávání: '"S. N. Koenig"'
Publikováno v:
2018 20th International Conference on Electronic Materials and Packaging (EMAP).
Four diffuser materials with different base polymers and fillers have been investigated for the purpose of direct integration into sensor packages. Therefore, the most important properties, namely transmission and scattering as well as behavior under