Zobrazeno 1 - 2
of 2
pro vyhledávání: '"S. M. Florio"'
Publikováno v:
Circuit World. 19:63-70
The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levellin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c210278c598c12e1d9fda2c8d506736
https://doi.org/10.1108/eb046192
https://doi.org/10.1108/eb046192
Publikováno v:
Corrosion. 39:151-158
Electrochemical etching experiments were conducted with Cu ion implanted H-19 Al foil in aqueous NaCl/Na2SO4 solution at 95 C in an effort to improve the procedure for the surface area enhancement of Al. The concentration of Cu in unimplanted and imp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d02168e5db5b3337967edac3004e80a
https://doi.org/10.5006/1.3580830
https://doi.org/10.5006/1.3580830