Zobrazeno 1 - 3
of 3
pro vyhledávání: '"S. L. Manikonda"'
Autor:
D. KAMEDA, T. KUBO, T. OHNISHI, K. KUSAKA, A. YOSHIDA, K. YOSHIDA, M. OHTAKE, N. FUKUDA, H. TAKEDA, K. TANAKA, N. INABE, Y. YANAGISAWA, Y. GONO, H. WATANABE, H. OTSU, H. BABA, T. ICHIHARA, Y. YAMAGUCHI, M. TAKECHI, S. NISHIMURA, H. UENO, A. YOSHIMI, H. SAKURAI, T. MOTOBAYASHI, T. NAKAO, Y. MIZOI, M. MATSUSHITA, K. IEKI, N. KOBAYASHI, Y. KAWADA, N. TANAKA, S. DEGUCHI, Y. SATOU, Y. KONDO, T. NAKAMURA, K. YOSHINAGA, C. ISHII, H. YOSHII, Y. MIYASHITA, N. UEMATSU, Y. SHIRAKI, T. SUMIKAMA, J. CHIBA, E. IDEGUCHI, A. SAITO, T. YAMAGUCHI, I. HACHIUMA, T. SUZUKI, T. MORIGUCHI, A. OZAWA, T. OHTSUBO, M. A. FAMIANO, H. GEISSEL, A. S. NETTLETON, O. B. TARASOV, D. BAZIN, B. M. SHERRILL, S. L. MANIKONDA, J. A. NOLEN
Publikováno v:
Fission and Properties of Neutron-Rich Nuclei.
Autor:
D. Kameda, T. Kubo, T. Ohnishi, K. Kusaka, A. Yoshida, K. Yoshida, M. Ohtake, N. Fukuda, H. Takeda, K. Tanaka, N. Inabe, Y. Yanagisawa, Y. Gono, H. Watanabe, H. Otsu, H. Baba, T. Ichihara, Y. Yamaguchi, M. Takechi, S. Nishimura, H. Ueno, A. Yoshimi, H. Sakurai, T. Motobayashi, T. Nakao, Y. Mizoi, M. Matsushita, K. Ieki, N. Kobayashi, Y. Kawada, N. Tanaka, S. Deguchi, Y. Satou, Y. Kondo, T. Nakamura, K. Yoshinaga, C. Ishii, H. Yoshii, Y. Miyashita, N. Uematsu, Y. Shiraki, T. Sumikama, J. Chiba, E. Ideguchi, A. Saito, T. Yamaguchi, I. Hachiuma, T. Suzuki, T. Moriguchi, A. Ozawa, T. Ohtsubo, M. A. Famiano, H. Geissel, A. S. Nettleton, O. B. Tarasov, D. Bazin, B. M. Sherrill, S. L. Manikonda, J. A. Nolen
Publikováno v:
PHYSICAL REVIEW C. 86(5)
A search for isomeric \ensuremath{\gamma} decays among fission fragments from 345 MeV/nucleon ${}^{238}$U has been performed at the RIKEN Nishina Center RI Beam Factory. Fission fragments were selected and identified using the superconducting in-flig
Autor:
C.-K. Hu, M. Angyal, B. C. Baker, G. Bonilla, C. Cabral, D. F. Canaperi, S. Choi, L. Clevenger, D. Edelstein, L. Gignac, E. Huang, J. Kelly, B. Y. Kim, V. Kyei-Fordjour, S. L. Manikonda, J. Maniscalco, S. Mittal, T. Nogami, C. Parks, R. Rosenberg, A. Simon, Y. Xu, T. A. Vo, C. Witt, Ehrenfried Zschech, Shinichi Ogawa, Paul S. Ho
Publikováno v:
AIP Conference Proceedings.
The impact of the existence of Cu grain boundaries on the degradation of Cu interconnect lifetime at the 45 nm technology node and beyond has suggested that improved electromigra‐tion in Cu grain boundaries has become increasingly important. In thi