Zobrazeno 1 - 10
of 47
pro vyhledávání: '"S. Jakschik"'
Autor:
S. Jakschik, D. Kesslau
Publikováno v:
Physics Procedia. 41:566-571
Ultra fast laser processing is marketed for processes which require small thermal impact to the product. The process has its advantages in processing speed and quality. Recent applications have been in photo-voltaic processing, surface treatment or p
Autor:
Roger Loo, G.S. Lujan, Byeong Chan Lee, Matty Caymax, Haruyuki Sorada, T.Y. Hoffmann, S Jakschik, Akira Inoue, S Hyun
Publikováno v:
Semiconductor Science and Technology. 22:S110-S113
Autor:
Lars-Ake Ragnarsson, Serge Biesemans, S. Jakschik, Thierry Conard, Christoph Adelmann, Annelies Delabie, Hag–Ju Cho, V.S. Chang, A. Akheyar, S. Van Elshocht, Hong Yu Yu, Tom Schram, T. Hantschel, Philippe Absil
Publikováno v:
IEEE Electron Device Letters. 29:743-745
Cap layers have been used to modulate the effective work function (EWF) for high- /metal-gate CMOS devices. We have investigated the impact of stacking cap layers on the EWF. Stacked cap layers consisting of two sequential cap layers, including, Al2O
Publikováno v:
Applied Physics Letters. 84:3076-3078
We analyze the field and temperature dependence of electron currents through atomic-layer-deposited thin (3.6–6 nm) sheets of Al2O3 which were annealed above the crystallization temperature. On the basis of electrical characterization and numerical
Autor:
S. Jakschik, S. Blei
Publikováno v:
Photonics Russia. :36-31
Autor:
S. Jakschik, T. Hoffmann, H.-J. Cho, A. Veloso, R. Loo, S. Hyun, H. Sorada, A. Inoue, M.d. Potter, G. Eneman, S. Severi, P. Absil, S. Biesemans
Publikováno v:
2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
This report presents high-k poly ring oscillators with a performance of tau=16.2 ps/st at 6E-6A/st for Lg=80 nm. This was achieved by using a SiGe channel for nFET and pFET. A minimum device length of 50 nm was built by using this technique. The tran
Autor:
T. Hecht, M. Gutsche, Uwe Schröder, G. Steinlesberger, Hans Reisinger, M. Leonhard, S. Jakschik, D. Schumann, H. Seidl
Publikováno v:
International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).
This work is intended to draw attention to the effect of dielectric relaxation which is shown to severely influence the performance of alternative dielectrics in DRAM storage capacitors as well as of the gate dielectrics of MOSFETs. A comparison of t
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Delamination of underfill in flip chips is a widely accepted major cause for failure. However, there is a lack of information on the mechanism of this effect. A novel methodology is used to examine these delaminations in this paper. Instead of the ex
Akademický článek
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Akademický článek
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