Alkyl methyl silicone phase change materials for thermal interface applications

Autor: Q.J. Feng, K. Wall, S.M. Zhang, T. Noll, S. Gelderbloom, D. Houtman, D. Swarthout, L. Petroff

Publikováno v: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Phase change materials (PCM) have shown several favorable characteristics as thermal interface materials (TIMs). Their main advantage is that they become flowable at the operation temperature, but are much less subject to pump-out than greases. As PC

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a56e129e82b6131d1740f1df7e2e5673
https://doi.org/10.1109/itherm.2002.1012495

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Shear Modulus Measurement for Thermal Interface Materials in Flip Chip Packages.

Autor: Jinlin Wang

Publikováno v: IEEE Transactions on Components & Packaging Technologies; Sep2006, Vol. 29 Issue 3, p610-617, 8p, 1 Black and White Photograph, 6 Charts, 8 Graphs

Phase change materials as a viable thermal interface material for high-power electronic applications.

Autor: Ramaswamy, C., Shinde, S., Pompeo, F., Sablinski, W., Bradley, S.

Publikováno v: Ninth Intersociety Conference on Thermal & Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543); 2004, p687-687, 1p