Zobrazeno 1 - 10
of 15
pro vyhledávání: '"S. G. Kumar"'
Publikováno v:
ECS Sensors Plus, Vol 2, Iss 1, p 017002 (2023)
Currently and also in future, the flexible and wearable strain sensor would be in high demand due to its direct applications in biomedical health monitoring and other engineering applications. The challenge is to make the flexible and wearable sensor
Externí odkaz:
https://doaj.org/article/a2909fe0a620469eada6935d0a8c3385
Autor:
S. G. Kumar, M. N. Bashir, Chakravarthula S.K. Raju, S. V. K. Varma, P. D. Prasad, S. A. Shehzad
Publikováno v:
Indian Journal of Physics. 96:491-501
An electrically conducting three-dimensional non-Newtonian Carreau fluid induced by bidirectional movement of sheet is demonstrated in this work. The aspects of viscous heating, radiation and first-order chemical reactions are executed in energy tran
Publikováno v:
Open Chemistry. 7:468-477
Degradation of Congo Red (CR) a di azo dye in aqueous solution is investigated by a Photo Fenton like process using Fe3+ ions as the catalyst and peroxy disulfate as the oxidant. The influence of various reaction parameters like, concentration of Fe3
Autor:
Ole Hoelck, G. Beer, G. Engelmann, S. G. Kumar, Bernhard Wunderle, Hans Walter, J. Heilmann, M. J. Wolf, Olaf Wittler, Klaus Pressel
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Through encapsulant vias (TEVs) are an interconnect technology which enables 3D stacking and double sided re-routing of packages encapsulated with epoxy molding compound. These interconnects are formed by Cu-plated holes through the encapsulant and c
Autor:
M. J. Wolf, Olaf Wittler, Klaus Pressel, Ole Hoelck, J. Heilmann, S. G. Kumar, Bernhard Wunderle, G. Engelmann, G. Beer, Hans Walter
Publikováno v:
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Through encapsulant vias (TEVs) are an interconnect technology which enables 3D stacking and double sided re-routing of packages encapsulated with epoxy molding compound. These interconnects are formed by Cu-plated holes through the encapsulant and c
Autor:
Ramana G. Reddy, S. G. Kumar
Publikováno v:
Metallurgical and Materials Transactions A. 27:1121-1126
A systematic investigation was undertaken to compare the effect of processing on the phase relations and microstructure of 66Ti-22Al-12Nb (in at. pct) alloy. The alloy was processed by three different routes: (1) cold pressing (CP) followed by reacti
Publikováno v:
Journal of Materials Engineering and Performance. 4:63-69
Titanium aluminides based on the ordered face-centered tetragonal γTiAI phase possess attractive properties, such as low density, high melting point, good elevated temperature strength, modulus retention, and oxidation resistance, making these alloy
Publikováno v:
Journal of Phase Equilibria. 15:279-284
Titanium aluminides are considered to be the future high-temperature structural materials for turbine applications. Major focus is on α2Ti3Al based and γTiAl based alloys. Niobium additions to Ti3Al alloys is found to improve the room-temperature d
Autor:
Ramana G. Reddy, S. G. Kumar
Publikováno v:
Metallurgical and Materials Transactions B. 25:91-96
A systematic investigation was undertaken to measure the solubility of Y2O3 in several LiF-YF2 melts, with the YF3 composition ranging from 20 to 50 mole pct, in the temperature range of 998 to 1273 K. Experimental results showed that the solubility
Autor:
Ramana G. Reddy, S. G. Kumar
Publikováno v:
Metallurgical Transactions B. 24:1031-1035
Solubility of Li2O in LiF-CaF2 melts was studied as a function of temperature, and it was found to increase from 10.6 wt pct at 1058 K to 14.8 wt pct at 1133 K. The liquidus temperature of 4LiF • CaF2 + Li2O (saturated) melt was determined to be 10