Zobrazeno 1 - 2
of 2
pro vyhledávání: '"S. F. N. Muhd Amli"'
Autor:
Jitrin Chaiprapa, N. R. Abdul Razak, Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, S. F. N. Muhd Amli, Mohd Izrul Izwan Ramli, Hideyuki Yasuda
Publikováno v:
Journal of Electronic Materials. 50:855-868
The effects of copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish reflowed on Sn-3.0Ag-0.5Cu (SAC305) solder have been investigated in detail. Besides conventional cross-sectional microstruc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1955e9d6fccb09761398d266dae92778
https://doi.org/10.1007/s11664-020-08641-6
https://doi.org/10.1007/s11664-020-08641-6
Autor:
Flora Somidin, Kazuhiro Nogita, Hideyuki Yasuda, Z. Shayfull, Mohd Izrul Izwan Ramli, Jitrin Chaiprapa, S. F. N. Muhd Amli, Mohd Arif Anuar Mohd Salleh
Publikováno v:
Journal of Electronic Materials. 50:710-722
This study examines factor(s) behind the formation of primary Cu6Sn5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys are hypoeutectic. To understand the contribution from copper (Cu) dissolution from the substr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b991d98368c898e868228168cf32b3c
https://doi.org/10.1007/s11664-020-08428-9
https://doi.org/10.1007/s11664-020-08428-9