Zobrazeno 1 - 10
of 15
pro vyhledávání: '"S. Cyrusian"'
Autor:
Laura Biolato, Q. Lu, G. Hatcher, M. Davoodi, M. Azarmnia, N. Fan, S. Jantzi, C. Abidin, W. Elsharkasy, A. M. Castrillon, E. Olsen, A. Fan, J. Chana, R. L. Nguyen, S. Dallaire, Benjamin T. Reyes, A. Mellati, S. Cyrusian, T. Dusatko, Luke Wang, F. Ahmad, S. Ho, N. Campos, L. Tse, Praveen Prabha
Publikováno v:
ISSCC
Low power digital signal processing (DSP) and optical integration have fueled the development of high-performance optical pluggable modules due to their deployment flexibility and network disaggregation. In addition, the rapid growth of new technolog
Autor:
K. Mistry, V. Giridharan, L. Tse, Praveen Prabha, T. Dusatko, S. Jantzi, Chang-Feng Loi, V. Gurumoorthy, N. Fan, K. Raviprakash, M. Takefman, Palash Mishra, Y. Ou, Cheng-Ru Ho, Belal Helal, S. Cyrusian, Jamal Riani, Qiwei Wang, T. Setya, R. Nagulapalli, Y. Liao, Q. Liu, V. Karam, J. Sun, M. Davoodi, Amber Tan, W. Liew, S. Scouten
Publikováno v:
ISSCC
Driven by the proliferation of rich media services and a drastic increase of data availability, the demand for high-speed data transfer in the data center continues to grow at greater than 26 percent year-over-year [1]. This urges the imminent soluti
Publikováno v:
ISCAS (6)
A fully integrated ring oscillator PLL for hard disk channel applications is presented. A number of 16 equidistant phases of the output clock, programmable in 0.4% steps between 200 MHz and 2.5 GHz are achieved by the use of a phase-switching fractio
Autor:
M. Vakilzadeh Moghaddam, S. Cyrusian
Publikováno v:
Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.
High frequency performance of chip-to-chip interconnections is primarily limited by the structure of chip mounting, vias and bends. The last two problems are investigated by full wave simulation technique. A great performance improvement is achieved.
Autor:
A. Koschel, S. Cyrusian
Publikováno v:
Proceedings of 1995 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference.
Applying state of the art numerical simulation techniques, we have investigated relevant aspects of flip chip contacting methods, which are essential for RF/microwave and optoelectronic applications. An overview of commonly used flip chip mounting me
Autor:
S. Cyrusian
Publikováno v:
ISCAS
A new approach for modeling coupled lossy transmission lines based on approximation of complex valued transfer functions by polynomial ratios is presented. The rational functions are simulated using state space representation. The model deals with th
Autor:
S. Cyrusian, G. Fotheringham
Publikováno v:
Proceedings of 1995 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference.
Various RF/microwave packaging structures are investigated by a numerical full wave analysis. In frequency ranges up to 80 GHz chip contacting methods are characterized. Coplanar waveguide-to-coax and -to-microstrip and coax-to-microstrip transitions
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Conference
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Conference
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