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Autor:
S. Cherekdjian, J. Nunes
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 96:118-122
The standard deviation of Test-Retest error provides an absolute measure of the error introduced by the measurement system. It does not, however, characterize the relative usefulness of the measurement system for measuring a specific product. Such a
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 96:87-91
Glow discharge mass spectrometry (GDMS) has been used to provide trace elemental analysis of tungsten filaments used in ion implantation technology. Results indicated very large potassium signals on all of the tungsten samples with levels from 310 to
Autor:
S. Cherekdjian, R. O. Maschmeyer, J. Cites, J. Tatemichi, Y. Inouchi, M. Onoda, K. Orihira, T. Matsumoto, M. Konishi, M. Naito, Jiro Matsuo, Masataka Kase, Takaaki Aoki, Toshio Seki
Publikováno v:
AIP Conference Proceedings.
A Nissin iG4 ion doping system (termed iG4) utilizes broad beam technology to implant GEN 4 sheets of glass for LCD production. The mechanical scanned end‐station with robotic handling for GEN 4 glass substrates was redesigned, and a new end‐stat
Autor:
S. Cherekdjian, J. G. Couillard, C. Wilcox, Jiro Matsuo, Masataka Kase, Takaaki Aoki, Toshio Seki
Publikováno v:
AIP Conference Proceedings.
Researchers at Corning Incorporated have developed a process whereby single crystal silicon thin films are transferred onto a flat panel display glass substrate using hydrogen ion implantation. The energy of the implant controls the effective exfolia
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 74:123-126
Ion beam channeling significantly influences the implanted dopant profile and increases the resultant junction depth. For electrostatic scan ion implanters this also manifests itself as a wafer non-uniformity. In this study, wafer sheet resistance ma
Autor:
S. Cherekdjian
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 74:259-262
A previous paper [Nucl. Instr. and Meth. B55 (1991) 178] has demonstrated that the correct equipment specification and process procedures enable the reliable direct probing of low dose sheet resistance monitors. Utilizing this, we are able to charact
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. :145-149
In order to characterize the deep damage produced by high-energy 0.5–2.0 MeV implants of As and P into p-type (100)Si, we have employed a laser induced photothermal reflectance measurement technique and the standard RBS/channeling technique using 2
Autor:
W. Weisenberger, S. Cherekdjian
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:178-182
Low-dose monitoring has always been a problem. The monitors drift with time either within minutes of an implant or within days or months. Resistivity excursions in excess of 50% are not uncommon. This paper presents data to understand some of the fac
Autor:
S. Cherekdjian, W. Weisenberger
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:30-34
The presence of energetic neutrals in a high-current, high-energy implant can result in nonuniformities on a silicon wafer. A larger concern is when the energetic neutrals are not of the desired energy. This is a major consideration when designing io