Zobrazeno 1 - 3
of 3
pro vyhledávání: '"S. C. Tighe"'
Publikováno v:
Polymer Engineering and Science. 30:609-617
Eight commercial semiconductor grade epoxy compounds that are used to encapsulate 1C (integrated circuit) devices have been evaluated for their ability to minimize the development of thermal stresses which can cause failure during device temperature
Autor:
S. C. Tighe, Louis Thomas Manzione
Publikováno v:
Polymer Engineering and Science. 28:949-954
Blowing agents are often used in the reaction injection molding process to compensate for the shrinkage that occurs upon polymerization, thereby creating a structural foam part. Controlling the thickness of the solid skin and foamed core is essential
Publikováno v:
Optical Fiber Communication.
This paper describes the first use of a single optical fiber, with an optical interference cavity formed at one end, to transduce pressure changes into changes in sensor reflectivity. Fiber-optic pressure transducers previously reported for biomedica