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Publikováno v:
2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
Discrepancies between estimated and actual thermal solution performance may negatively bias early system design decisions and ultimately result in costly redesigns. In particular, an overreliance on manufacturer-provided performance data and insuffic
Publikováno v:
International Symposium on Microelectronics. 2013:000452-000457
As high performance computing (HPC) system performance requirements increase, it is necessary to investigate new methods for integrating system components. Of interest is the applicability of 3D packaging approaches to HPC systems. Using thermal test