Zobrazeno 1 - 10
of 112
pro vyhledávání: '"S. Bouwstra"'
Autor:
Rudy R. Negenborn, Gonçalo Homem de Almeida Correia, Bilge Atasoy, Peter Bijl, Pieter S. Bouwstra
Publikováno v:
ITSC
Proceedings of the 2021 IEEE International Intelligent Transportation Systems Conference (ITSC)
Proceedings of the 2021 IEEE International Intelligent Transportation Systems Conference (ITSC)
The quality of the delivery service is a crucial asset for an e-grocer to create and maintain a loyal customer-base. With the rapid market growth of e-grocers over the last decade, there is an urgent need for e-grocer specific routing systems. Althou
Autor:
Sidarto Bambang Oetomo, Ibi Idowu Ayoola, Wei Chen, S. Bouwstra, Sae Sietse Dols, Lmg Loe Feijs
Publikováno v:
Journal of Healthcare Engineering, Vol 1, Iss 4, Pp 535-554 (2010)
Journal of Healthcare Engineering, 1(4), 535-554. Multi-Science Publishing Co. Ltd
Journal of Healthcare Engineering, 1(4), 535-554. Multi-Science Publishing Co. Ltd
Continuous health status monitoring and advances in medical treatments have resulted in a significant increase of survival rate in critically ill infants admitted into Neonatal Intensive Care Units (NICUs). The quality of life and long-term health pr
Publikováno v:
Journal of Microelectromechanical Systems. 13:452-464
A variety of different silicon structures has been fabricated and characterized mechanically to optimize the design of silicon ribbon cables used in neural probes and multichip packaging structures. Boron-doped 3-/spl mu/m-thick silicon beams were te
Autor:
S. Bouwstra, R. K. Vestergaard
Publikováno v:
Microsystem Technologies. 6:214-217
In the work presented in this article a fabrication process for high aspect ratio metal microstructures has been developed using photoresist EPON SU-8. A smallest feature size of 2 μm with near vertical sidewalls has been achieved on a routine basis
Publikováno v:
Journal of Intelligent Material Systems and Structures. 9:749-754
In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other wi
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 19:516-522
A novel wafer through-hole technique with a high vertical wiring density is introduced compatible with standard semiconductor processes. The basic idea is to realize metallic interconnection lines on the inclined sidewalls of anisotropically etched t
Publikováno v:
Proceedings of the 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC, 30 August-3 September 2011, Boston, Massachussetts, 2488-2491
STARTPAGE=2488;ENDPAGE=2491;TITLE=Proceedings of the 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC, 30 August-3 September 2011, Boston, Massachussetts
EMBC
STARTPAGE=2488;ENDPAGE=2491;TITLE=Proceedings of the 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC, 30 August-3 September 2011, Boston, Massachussetts
EMBC
When designing an ECG monitoring system embedded with textile electrodes for comfort, it is challenging to ensure reliable monitoring, because textile electrodes suffer from motion artifacts and incidental poor signal quality. For the design of a com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::89776b48a74467d30e38b30d6ae32c44
https://research.tue.nl/en/publications/da4e7b9f-93b8-4b74-9ad4-9dd74336f8ac
https://research.tue.nl/en/publications/da4e7b9f-93b8-4b74-9ad4-9dd74336f8ac
Autor:
Wei Chen, Roland Coops, S. Bouwstra, Son Tung Nguyen, Lindsay Brown, Loe Feijs, Sidarto Bambang Oetomo
Publikováno v:
Proceedings of Third International Workshop on Wireless Sensor Networks: Theory and Practice, in conjunction with the 4th IFIP International Conference on New Technologies, Mobility and Security, 7-11 February 2011, Paris, France
NTMS
NTMS
In this paper, we present the application of wireless sensor technology and the advantages it will inherently have for neonatal care and monitoring at Neonatal Intensive Care Units (NICU). An electrocardiography (ECG) readout board and a wireless tra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8ba9e4fd2d42727a5a78f1ac2de9cde9
https://research.tue.nl/nl/publications/d11a1e32-e79b-4434-b271-cec42fdbe4b4
https://research.tue.nl/nl/publications/d11a1e32-e79b-4434-b271-cec42fdbe4b4
Publikováno v:
Journal of micromechanics and microengineering, 3(4), 243-246. IOP Publishing Ltd.
ISSUE=4;TITLE=4th MicroMechanics Europe Workshop, MME 1993
ISSUE=4;TITLE=4th MicroMechanics Europe Workshop, MME 1993
Thin square membranes including a deep circular corrugation are realized and tested for application in a strain-based pressure sensor. Package-induced stresses are reduced and relief of the residual stress is obtained, resulting in a larger pressure
Autor:
H A C Tilmans, S Bouwstra
Publikováno v:
Journal of Micromechanics and Microengineering. 3:198-202
A novel design of low differential-pressure sensor is presented which uses a bossed diaphragm as the spring element and built-in resonant strain gauges to provide a frequency output. A differential resonator design is employed to compensate for unwan