Zobrazeno 1 - 10
of 32
pro vyhledávání: '"S. Becu"'
Autor:
C. Le Royer, B. Mohamad, J. Biscarrat, L. Vauche, R. Escoffier, J. Buckley, S. Becu, R. Riat, C. Gillot, M. Charles, S. Ruel, P. Pimenta-Barros, N. Posseme, P. Besson, F. Boudaa, C. Vannuffel, W. Vandendaele, A.G. Viey, A. Krakovinsky, M.-A. Jaud, R. Modica, F. Iucolano, R. Le Tiec, S. Levi, M. Orsatelli, R. Gwoziecki, V. Sousa
Publikováno v:
2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
Autor:
R. Kom Kammeugne, C. Theodorou, C. Leroux, L. Vauche, X. Mescot, R. Gwoziecki, S. Becu, M. Charles, E. Bano, G. Ghibaudo
Publikováno v:
Solid-State Electronics
Solid-State Electronics, 2023, 200, pp.108555. ⟨10.1016/j.sse.2022.108555⟩
Solid-State Electronics, 2023, 200, pp.108555. ⟨10.1016/j.sse.2022.108555⟩
International audience
Autor:
R. Kom Kammeugne, C. Theodorou, C. Leroux, X. Mescot, L. Vauche, R. Gwoziecki, S. Becu, M. Charles, E. Bano, G. Ghibaudo
Publikováno v:
IEDM2021-IEEE International Electron Devices Meeting
IEDM2021-IEEE International Electron Devices Meeting, Dec 2021, San Francisco, United States. pp.39.4.1-39.4.4, ⟨10.1109/IEDM19574.2021.9720522⟩
IEDM2021-IEEE International Electron Devices Meeting, Dec 2021, San Francisco, United States. pp.39.4.1-39.4.4, ⟨10.1109/IEDM19574.2021.9720522⟩
International audience; This paper investigates the AlGaN/GaN and Al2O3/GaN interface quality on GaN MIS-HEMT using low frequency noise (LFN) measurements. To address the issue of noise in the access resistance, we have also tested "non-gated" 2DEG d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb61c3bc315dc58cdcf6db450771e58a
https://hal.science/hal-03762149
https://hal.science/hal-03762149
Akademický článek
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Akademický článek
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Autor:
M. Vinet, J.-M. Pedini, S. Becu, M. Collonge, T. Ernst, Bernard Previtali, M. Ribeiro, Gerard Ghibaudo
Publikováno v:
2009 International Symposium on VLSI Technology, Systems, and Applications.
For the first time, an analytical model of an Accumulation-Mode Suspended-Gate MOSFET is proposed. For very low power operation, adhesion energies of gate and gate oxide as low as 130µJ/m2 are required as well as sub-2.3N/m doubly clamped gate. Expe
Autor:
Sébastien Barnola, Virginie Loup, S. Pauliac, S. Becu, Bernard Guillaumot, F. Aussenac, Arnaud Hubert, G. Garnier, Cecilia Dupre, C. Vizioz, J.M. Hartmann, Simon Deleonibus, Gerard Ghibaudo, L. Baud, J. P. Colonna, Maurice Rivoire, Christian Arvet, M. Jublot, F. Allain, V. Maffini-Alvaro, Thierry Chevolleau, P. Rivallin, Thomas Ernst, O. Faynot
Publikováno v:
2008 IEEE International Electron Devices Meeting.
For the first time, we report a 3D stacked sub-15 nm diameter NanoWire FinFET-like CMOS technology (3D-NWFET) with a new optional independent gate nanowire structure named PhiFET. Extremely high driving currents for 3D-NWFET (6.5 mA/mum for NMOS and
Autor:
Simon Deleonibus, Nathalie Vulliet, Philippe Coronel, Bernard Guillaumot, Thomas Skotnicki, Arnaud Hubert, Jean-Michel Hartmann, Cecilia Dupre, S. Becu, Olivier Thomas, C. Vizioz, E. Bernard, Thomas Ernst, Olivier Rozeau, O. Faynot
Publikováno v:
2008 IEEE International Conference on Integrated Circuit Design and Technology and Tutorial.
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CM
Autor:
Thomas Ernst, Simon Deleonibus, Sébastien Barnola, Erwan Dornel, Cecilia Dupre, Jean-Charles Barbe, S. Becu, Francois Andrieu, C. Vizioz, O. Faynot, Vincent Delaye, J-M. Hartmann, Gerard Ghibaudo, Thierry Poiroux
Publikováno v:
Extended Abstracts of the 2007 International Conference on Solid State Devices and Materials.
Autor:
S. Boret, S. Bruyere, Daniel Benoit, C. Besset, Philippe Delpech, J.-P. Manceau, M. Marin, C. Richard, S. Guillaumet, Alexis Farcy, A. Bonnard, M. Thomas, Sebastien Cremer, S. Becu, C. Perrot, N. Segura
Publikováno v:
2006 Bipolar/BiCMOS Circuits and Technology Meeting.
RF and analog designs require high performances MIM capacitors. In order to continue downscaling of MIM devices, we have developed and integrated a 3D damascene MIM capacitor in the copper back-end of a 0.13 mum BICMOS technology. Si3N4 has been used