Zobrazeno 1 - 10
of 37
pro vyhledávání: '"S. A. Simeonov"'
Publikováno v:
IEEE Transactions on Electron Devices. 59:1738-1744
The statistical variability of the static noise margin of a six-transistor bulk complementary metal-oxide-semiconductor static random access memory (SRAM) cell due to random doping fluctuations (RDFs) is investigated via 3-D technology computer-aided
Autor:
Zhiqiang Tan, U von Matt, Andrey B. Kucherov, Pratheep Balasingam, K. El Sayed, I. Avci, M. D. Johnson, B. Polsky, A R Saha, S. Tian, S. D. Simeonov, Luis Villablanca, E. Lyumkis
Publikováno v:
IEEE Transactions on Electron Devices. 58:1189-1196
In this paper, we study the impacts of proximity effects on the electrical characteristics Id-Vg and the static noise margin of a six-transistor (6T) bulk complementary metal-oxide-semiconductor (MOS) static random access memory (SRAM) cell using 3-D
Autor:
E Kafedjiiska, S S Simeonov
Publikováno v:
Semiconductor Science and Technology. 12:1016-1027
I - V forward current characteristics of Si Schottky diodes are measured in the 80 - 291 K temperature range. The apparent decrease of the electron barrier height at the metal - semiconductor (M - S) interface, , and the increase of the ideality fact
Publikováno v:
JOM. 49:48-52
Publikováno v:
Metallurgical and Materials Transactions B. 28:191-200
A relationship between copper in slag and copper in matte during copper sulfide smelting has been derived using industrial data from 42 plants employing blast furnaces, reverberatory furnaces, flash furnaces, and Mitsubishi smelting furnaces together
Autor:
Zudian Qin, Mankoo Lee, S. D. Simeonov, K. El Sayed, I. Avci, Yong-Seog Oh, Pratheep Balasingam, Dipu Pramanik
Publikováno v:
2013 IEEE International Reliability Physics Symposium (IRPS).
A physically based simulation methodology provides fast and practical EM lifetime prediction. We identified an “EM-aware” region to define the length dependence of Cu-lines under high current stress. For eventual calibration of 2× nm node Cu-lin
Autor:
K. El-Sayed, I. Avci, W. Zhou, Yong-Seog Oh, Pratheep Balasingam, M. Zhu, Andrey B. Kucherov, Zudian Qin, M. D. Johnson, S. D. Simeonov, S. Tian, B. Polsky, V. Chawla, B. Mishra, Xiaopeng Xu, S. Li
Publikováno v:
2012 IEEE International Interconnect Technology Conference.
The reliability of complex interconnect structures at all levels of the chip integration hierarchy has become a major concern due to the use of fine feature sizes, diverse materials, and complex 3D architectures. Reliability issues range from stress
Publikováno v:
physica status solidi (a). 122:K147-K150
Les niveaux profonds aux complexes de lacunes donneuses sont des centres de generation-recombinaison. L'influence observee du bombardement des substrats de Si, avec des ions Ar de 1 keV, s'explique par la generation de tels niveaux profonds dans les
Autor:
S. D. Simeonov, P. P. Kircheva
Publikováno v:
Journal of Raman Spectroscopy. 21:55-63
The influence of thermally excited vibrations on vibronic spectra (absorption, CARS excitation profile and resonance background) has been modelled for polyatomic molecules in solution. It is shown that for a model describing some polymethine compound