Výsledky vyhledávání - "S. A. Eladly"

Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications

Autor: S. A. Eladly, Mahmoud S. Dawood, A. M. El-Taher

Publikováno v: Arab Journal of Nuclear Sciences and Applications. 54:85-96

In this study, the effects of adding 0.1-0.2wt.%Al on microstructure and creep properties of Sn–0.7Cu-0.2Ni (SCN) alloys were investigated. The presence of Ni in SCN alloy inhibits the polymorphic transition of Cu6Sn5 IMC particles and forms a more

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c5059198c6e91ccfd403af2adf1728b1
https://doi.org/10.21608/ajnsa.2021.29270.1349

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Improvement of strength-ductility trade-off in a Sn–0.7Cu–0.2Ni lead-free solder alloys through Al-microalloying

Autor: S. A. Eladly, Mahmoud S. Dawood, A.A. El-Daly, T.A. Elmosalami, Amal A. Mohamed

Publikováno v: Journal of Materials Science: Materials in Electronics. 31:8649-8661

The enhancement in strength is generally attended by ductility loss in lead-free solder alloys, which is commonly denoted as strength-ductility trade-off (SDT). This work provides new viewpoint on the design of novel Sn–0.7Cu–0.2Ni (SCN) solders

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1cd2927d32ecacea5c9bcafe8584106f
https://doi.org/10.1007/s10854-020-03400-z

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Akademický článek

Improvement of strength-ductility trade-off in a Sn–0.7Cu–0.2Ni lead-free solder alloys through Al-microalloying.

Autor: El-Daly, A., Eladly, S. A., Mohamed, Amal, Elmosalami, T. A., Dawood, Mahmoud S.

Publikováno v: Journal of Materials Science: Materials in Electronics; Jun2020, Vol. 31 Issue 11, p8649-8661, 13p

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