Zobrazeno 1 - 10
of 18
pro vyhledávání: '"S, Soreda"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f69c0466652febf9f418135769bddc5
https://doi.org/10.1109/eptc56328.2022.10013163
https://doi.org/10.1109/eptc56328.2022.10013163
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd6c4264f97d5ec70b46bf786ea6d947
https://doi.org/10.1109/eptc53413.2021.9663888
https://doi.org/10.1109/eptc53413.2021.9663888
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Quad-Flat No Lead Multi-row (QFN-mr) is a common type of integrated circuit (IC) package that is leadless and plastically encapsulated in build. Before being cut into units through singulation process, QFN-mr packages are in Cu leadframe strip form a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b16f46a7ae60d1510a610248b928d920
https://doi.org/10.1109/eptc50525.2020.9315087
https://doi.org/10.1109/eptc50525.2020.9315087
Package Singulation partial cut process of a Quad Flat No Leads (QFN) Package is now well-known at semiconductor manufacturing to enhance the Automatic Optical Inspection (AOI) capability of a finished Integrated Circuit (IC) device when subjected in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0e303d1cbe9d045a5c263c3e7f59589e
Package Tape sawing process requires mounting of molded strip package into Ultraviolet (UV) Tape by means of manual, semi-automatic and automatic mounting process.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1f65862647b227606369689db20bcaea
Quad Flat No leads (QFN) Packages used copper base lead frame that was commonly known as a ductile material which has challenging methods on package sawing process such as pre-cut sawing for Automotive products on manufacturing today.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::26185850893d894ddb192bf8b25b82f3
Package sawing process in semiconductor assembly manufacturing is a process typically performed to separate integrated circuit packages such as IC chips from a substrate / leadframe in order to form the individual units.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a4cd5b8f7e60249b3b2fb5c4c937869
Publikováno v:
Anesthesiology. 93(3)
Although various drugs used by anesthesiologists highly bind to plasma proteins, the impact of iatrogenically induced hypoproteinemia on their pharmacologic effects has never been investigated. The authors determined the pharmacokinetics of ceftriaxo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::7620d5c770884f08ba4a408b6ae37491
https://pubmed.ncbi.nlm.nih.gov/10969307
https://pubmed.ncbi.nlm.nih.gov/10969307
Autor:
R. Langlois, P. Forcet, R. Boissinot, L. Ringuet, M. Nguyen-Sala, H. Lee, V. Vallade, S. Soreda
Publikováno v:
Le Pharmacien Hospitalier et Clinicien. 47:S7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98b7d5a60ab156d1eee51872d0f214c4
https://doi.org/10.1016/j.phclin.2011.12.017
https://doi.org/10.1016/j.phclin.2011.12.017
Publikováno v:
Annales Françaises d'Anesthésie et de Réanimation. 17:840
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afd460eed801d34d93d7d10495b76fc1
https://doi.org/10.1016/s0750-7658(98)80175-5
https://doi.org/10.1016/s0750-7658(98)80175-5