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pro vyhledávání: '"S, Geyik"'
Akademický článek
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Publikováno v:
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76cc9b780fea3c9f8efa4c5f52ede181
https://doi.org/10.1109/edaps56906.2022.9995177
https://doi.org/10.1109/edaps56906.2022.9995177
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:1380-1390
The ever-increasing demand for higher bandwidth and lower loss makes the predictability of high-speed interconnect performance increasingly challenging. Validating models against measurements of manufactured test structures requires not only accurate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a191054af60c23f0c1fbd13546636177
https://doi.org/10.1109/tcpmt.2021.3101456
https://doi.org/10.1109/tcpmt.2021.3101456
Publikováno v:
Sensors, Vol 20, Iss 3, p 764 (2020)
Wearable internet of things (IoT) devices can enable a variety of biomedical applications, such as gesture recognition, health monitoring, and human activity tracking. Size and weight constraints limit the battery capacity, which leads to frequent ch
Externí odkaz:
https://doaj.org/article/ad4c9b75761b437e8104b3ae00f86bf8
Akademický článek
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Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1942-1951
Use conditions based on temperature and humidity can have a significant impact on the package material properties and loss, which is required to be included in modeling assumptions to be able to set realistic specifications. The dielectric loss is af
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c981d88b590dc99f5f9674839290af9
https://doi.org/10.1109/tcpmt.2019.2926355
https://doi.org/10.1109/tcpmt.2019.2926355
Publikováno v:
ISQED
This paper presents a machine learning based modeling methodology to analyze the impact of high-volume manufacturing process variations on electrical performance of high-speed interconnects, that overcomes the limitations of traditional approaches. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1bd1ae6466c2e8958634a793a560893
https://doi.org/10.1109/isqed51717.2021.9424359
https://doi.org/10.1109/isqed51717.2021.9424359
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Validating the performance of high-speed interconnect modeling against measurements of fabricated test structures requires an understanding of the robustness of the measurement methods as well as the physical variations present in an imperfectly fabr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0b5e9ec00453fb6a263ffe9f66af3d3
https://doi.org/10.1109/epeps48591.2020.9231369
https://doi.org/10.1109/epeps48591.2020.9231369
Publikováno v:
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
The solder joint of the ball grid array (BGA) package becomes a performance bottleneck as the serializer/deserializer (SerDes) speeds increase beyond 112 Gbps. This paper presents a comprehensive methodology to correctly model the volume and shape va
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::291b379e9e754147757a967fc75913cd
https://doi.org/10.1109/epeps48591.2020.9231449
https://doi.org/10.1109/epeps48591.2020.9231449
Publikováno v:
IEEE Transactions on Antennas and Propagation. 66:4123-4136
A methodology for objective empirical comparisons of competitive computational methods for solving bioelectromagnetics problems is presented. The proposed comparison methodology consists of three steps: 1) a problem of interest is identified, models
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dd0e8f45e10b7d2d08ab8a29e08d136
https://doi.org/10.1109/tap.2018.2835512
https://doi.org/10.1109/tap.2018.2835512