Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Ryuichi Matsuki"'
Publikováno v:
2019 IEEE CPMT Symposium Japan (ICSJ).
For precisely predicting the thermal warpage of IC package substrates, we have performed high-resolution and large-scale finite element analyses by using an open-source structural analysis software, FrontISTR. It is found that the thermal warpage con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a157d3f17287aeeebafdfa6cfd17e9e7
https://doi.org/10.1109/icsj47124.2019.8998668
https://doi.org/10.1109/icsj47124.2019.8998668
Publikováno v:
Journal of Electronic Packaging. 126:440-448
Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the pac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::90ef712ce575b30df0095e401507a041
https://doi.org/10.1115/1.1827259
https://doi.org/10.1115/1.1827259
Publikováno v:
Journal of the Japan Society of Powder and Powder Metallurgy. 41:1232-1237
Effects of TiC and three kinds of ZrO2(unstable, 2mol%Y2O3 doped, 3mol%Y2O3 doped) dispersions on the microstructure, fracture strength and toughness were investigated for Al2O3/TiC/ZrO2 composites. These composites were fabricated by hot-pressing th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2699b9d0394b7dac2b43dc8cecdfda8c
https://doi.org/10.2497/jjspm.41.1232
https://doi.org/10.2497/jjspm.41.1232
Autor:
Masaru Ishizuka, Wataru Nakayama, Ryuichi Matsuki, Takashi Fukue, Hiroko Ohta, Tatsuya Nakajima, Katsuhiro Koizumi
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
The high-density interconnection substrate invariably poses enormous difficulty to thermal design analysts due to complex metal layout patterns embedded in the dielectric matrix. A modeling method is proposed, which produces effective thermal conduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f3ec3d33ff9868d6e20b98d7a873bd1
https://doi.org/10.1109/itherm.2010.5501402
https://doi.org/10.1109/itherm.2010.5501402
Autor:
Takashi Fukue, Hiroko Koike, Katsuhiro Koizumi, Ryuichi Matsuki, Wataru Nakayama, Masaru Ishizuka, Tatsuya Nakajima
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
The issue addressed in the present study is how to model wiring substrates to perform heat conduction analysis on moderate computational resource. Equivalent thermal conductivity is a convenient measure in thermal modeling. However, its notion needs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::249bf7b3e12d58142719f46937b46244
https://doi.org/10.1115/interpack2009-89086
https://doi.org/10.1115/interpack2009-89086
Publikováno v:
Journal of the Japan Society of Powder and Powder Metallurgy. 38:365-368
High density Al2O3/TiC composites were fabricated by a conventional hot-pressing of mixtures of Al2O3 and TiC powders at 1700-1900°C in Ar atmosphere. Transmission electron microscopic observations revealed that TiC particles were dispersed not only
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::531d45120660ef5f0ba3fb9794549da1
https://doi.org/10.2497/jjspm.38.365
https://doi.org/10.2497/jjspm.38.365
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
Addressed in the present study is the required accuracy in assuming equivalent thermal conductivities of printed circuit boards (PCBs) in the thermal analysis of electronic equipment. The required accuracy depends on the morphology of PCB and the the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3630fb54f9a04f929064ecf46c36f185
https://doi.org/10.1115/ipack2007-33605
https://doi.org/10.1115/ipack2007-33605
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
The PCB in high density packaging environment often provides a critical heat conduction path from the package to the electrical connectors or the system enclosure that serves as a solid heat sink at the edge of the PCB. Where convective heat transfer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63bff7f6a19ab7bc0cd7b3e9afe50137
https://doi.org/10.1115/ipack2007-33606
https://doi.org/10.1115/ipack2007-33606
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology.
Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the pac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13a06f76532587b85a7c0139bcbd007e
https://doi.org/10.1115/imece2003-42181
https://doi.org/10.1115/imece2003-42181
Publikováno v:
Computational Fluid and Solid Mechanics 2003
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39766458d389d4eb52386cf45cbee287
https://doi.org/10.1016/b978-008044046-0.50593-5
https://doi.org/10.1016/b978-008044046-0.50593-5
