Výsledky vyhledávání - "Ryosuke Kimoto"

Establishment of Estimate Methods on Impact Strength of Lead-Free Solder Joints in BGA Packages (1) Dependence of Failure Modes of Solder Joints under Impact Load on Strain of PWB

Autor: Akihiro Yaguchi, Hisashi Tanie, Nobutada Ohno, Ryosuke Kimoto, Kenichi Yamamoto, Yasuhiro Naka

Publikováno v: Journal of Japan Institute of Electronics Packaging. 13:204-212

製造工程内や携帯機器使用時の落下などの衝撃負荷によるPbフリーBall Grid Array（BGA）はんだ接続部の破壊挙動を検討するため，21 mm角BGAパッケージプリント配線板実装試験片について，衝

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fd9741c4e422a5d9b3906029c84be769
https://doi.org/10.5104/jiep.13.204

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Effect of Ni Plating Condition on Lead-Free Solder Joints Reliability of BGA Using Electroplated Ni/Au under Impact Load

Autor: Masahiro Koizumi, Haruo Akahoshi, Ryosuke Kimoto, Ryohei Satoh, Toshinori Kawamura, Kenichi Yamamoto, Takahiko Kato

Publikováno v: Journal of Japan Institute of Electronics Packaging. 10:305-313

Tests were performed to evaluate the impact strength and analyze the fracture mechanism of Sn-3mass%Ag-0.5mass%Cu solder joints on electroplated Ni/Au BGAs. The impact strength of solder joints deteriorates with higher concentrations of impurities (C

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::073937a1d88adff8eb6d91b9f82cf4b1
https://doi.org/10.5104/jiep.10.305

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Evaluation of Fatigue Strength of Wiring in Solder Joint Pads in LSI Packages

Autor: Akihiro Yaguchi, Ryosuke Kimoto, Takashi Miwa

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 72:192-199

We developed a method to evaluate the life of the wiring in non-solder mask defined (NSMD) solder joint pads in an LSI package. Generally, in a thermal cycling test, a package with NSMD pads has a longer life than a package with conventional pads. Ho

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7cecbca99dcaebcdcaf003974209848b
https://doi.org/10.1299/kikaia.72.192

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Strength Evaluation of Specimens Mounted with Underfill Resins in Mobile Apparatus

Autor: Akihiro Yaguchi, Masato Nakamura, Kazuhito Kurosawa, Takashi Ishikawa, Ryosuke Kimoto

Publikováno v: Journal of Japan Institute of Electronics Packaging. 7:613-621

携帯機器用BGAパッケージのはんだ接続部強度向上に適したアンダーフィル実装構造確立のため, 機械的負荷や熱疲労に対するはんだ接続部強度に, 樹脂物性や塗布形状が及ぼす影響を実験

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8e0bb7567ab59dbb5dc99286f3ece6eb
https://doi.org/10.5104/jiep.7.613

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