Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Ryoji Okuda"'
Publikováno v:
International Symposium on Microelectronics. 2017:000029-000035
We investigated the effects of photosensitive system (positive and negative) and polymer structures on Cu migration under bias HAST test. The HAST condition is 130C for 85% RH. Bias condition is 2MV/m. We found that there is polyimide structure shows
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6453b7bbb9c476edc465c3952310ac6
https://doi.org/10.4071/isom-2017-tp15_126
https://doi.org/10.4071/isom-2017-tp15_126
Publikováno v:
Journal of Photopolymer Science and Technology. 30:181-185
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05733ad62a7fc211e1cd2da903e015fd
https://doi.org/10.2494/photopolymer.30.181
https://doi.org/10.2494/photopolymer.30.181
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Low temperature curable photosensitive polyimide having extremely good Cu migration resistance were developed by examining the polyimide structure, photo chemistry, cross-linkers. We observed the polyimide structure affected the Cu migration resistan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcf00a6d065166bbcef7439c73ef8985
https://doi.org/10.23919/icep.2018.8374299
https://doi.org/10.23919/icep.2018.8374299
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
Positive tone photosensitive polyimide having low temperature curability and extremely good Cu migration was developed. In order to develop, we investigated the effect of polyimide structure and photosensitive method. We observed the polyimide struct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68f38915eaba72d9436ce7b03bb60a3d
https://doi.org/10.23919/panpacific.2018.8319010
https://doi.org/10.23919/panpacific.2018.8319010
Publikováno v:
Journal of Photopolymer Science and Technology. 28:73-77
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3e6c2f915e2562a11f880dd6e768380
https://doi.org/10.2494/photopolymer.28.73
https://doi.org/10.2494/photopolymer.28.73
Autor:
Hashimoto Keika, Yu Shoji, Takenori Fujiwara, Yutaro Koyama, Yuki Masuda, Ryoji Okuda, Kimio Isobe, Hitoshi Araki, Masao Tomikawa
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
In this study, we have developed low-temperature curable positive-tone photo-definable dielectric materials with high elongation property for redistribution layers (RDLs). This high elongation concept introduces a flexible molecular skeleton in the b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22ae815ee0386abdedd827b2b1901914
https://doi.org/10.1109/eptc.2017.8277585
https://doi.org/10.1109/eptc.2017.8277585
Autor:
Hitoshi Araki, Yutaro Koyama, Yuki Masuda, Masao Tomikawa, Ryoji Okuda, Yu Shoji, Kimio Isobe, Hashimoto Keika
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
Fan-Out Wafer Level Packages (FOWLPs) and Fan-Out Panel Level Packages (FOPLPs) have been proposed for promising candidates of the advanced packages for multifunctional LSI with many I/O (input/output). FOPLP is expected to reduce the cost of FOWLP b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c21dc1f1781b012e537aad0011b778b
https://doi.org/10.1109/icsj.2017.8240099
https://doi.org/10.1109/icsj.2017.8240099
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Novel Low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongationhave been developed as dielectric layers for copperredistribution layers (RDLs). The posi-PSPIs show lowtemperature curable nature, strong adhesion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f371194ab336b68702a0e79d41ab5641
https://doi.org/10.1109/ectc.2016.149
https://doi.org/10.1109/ectc.2016.149
Publikováno v:
Journal of Photopolymer Science and Technology. 23:775-779
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfaa002a91e3b80508df21e2a408027f
https://doi.org/10.2494/photopolymer.23.775
https://doi.org/10.2494/photopolymer.23.775
Publikováno v:
Journal of Photopolymer Science and Technology. 17:207-213
We developed novel positive-tone photosensitive polyimide coatings for insulation layers in organic light emitting diode (OLED) displays. We evaluated the features of the novel coatings in comparison to other candidate polymers including novolak resi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9063e28b55d271661212956f5be12beb
https://doi.org/10.2494/photopolymer.17.207
https://doi.org/10.2494/photopolymer.17.207