Zobrazeno 1 - 7 of 7 pro vyhledávání: '"Ryoichi Kurosaki"'
1
Nanoscopic fluctuation in quenched Zr–Cu–Ni–Al metallic glasses and their welds examined by ASAXS at Zr–K edge
Autor: Hiroshi Okuda, Yoshihiko Yokoyama, Isao Murase, K. Inoue, Ryoichi Kurosaki, S. Oshiai, Junji Saida, E. Nakagawa
Publikováno v: Intermetallics. 14:1038-1042
Anomalous small-angle scattering (ASAXS) measurements at Zr–K absorption edge were carried out to examine precursory structural and/or chemical fluctuation of quenched quaternary ZrCuNiAl bulk metallic glasses and their welds. The measurements were
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::56746769b22951ae60544b45d97d3c5c
https://doi.org/10.1016/j.intermet.2006.01.034
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2
Formation of Cu-Sn alloy layer by contact deposition using quaternary ammonium-imide-type ionic liquid
Autor: Yasuhiro Awakura, Takuma Katase, Tetsuji Hirato, Kuniaki Murase, Ryoichi Kurosaki
Publikováno v: ELECTROCHEMICAL AND SOLID STATE LETTERS. 9(4):C69-C72
Galvanic contact formation of a Cu-Sn alloy layer was investigated using an ionic liquid, trimethyl-n-hexylammonium bis[(trifluoromethyl)sulfonyl]amide, as a solvent for an electrolytic bath. The use of the ionic liquid rendered it possible to raise
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4d71dd77f866d952c7227e8e2c77d9ed
http://hdl.handle.net/2433/34929
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4
Scanning Anomalous Small-Angle Scattering as a Tool to Examine Welded Bulk Glass
Autor: Kanryu Inoue, Hiroshi Okuda, Ryoichi Kurosaki, Shojiro Ochiai, Isao Murase, Akihisa Inoue, Yoshihiko Yokoyama
Publikováno v: Materials Science Forum. :3401-3404
Small-angle scattering measurements utilizing anomalous dispersion effect just below the Zr and Ni K edge have been made for welded Zr-based amorphous materials. The measurements were carried out at a bending magnet beam-line 40B of SPring8. A small
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7614871cda53904f9bbd428536bdcec1
https://doi.org/10.4028/www.scientific.net/msf.475-479.3401
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5
Electrochemical Alloying of Copper Substrate with Tin Using Ionic Liquid as an Electrolyte at Medium-Low Temperatures
Autor: Tetsuji Hirato, Yasuhiro Awakura, Kuniaki Murase, Takuma Katase, Hiroyuki Sugimura, Ryoichi Kurosaki
Publikováno v: Journal of The Electrochemical Society. 154:D612
Electrochemical alloying of Cu substrate through a reduction-diffusion method was investigated using ionic liquid, trimethyl-n-hexylammonium bis[(trifluoromethyl)sulfonyl]amide, as a solvent for an electrolytic bath. The use of the ionic liquid rende
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::297bf2c011f31ce9930fbd463678c296
https://doi.org/10.1149/1.2776230
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