Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Ryan Persons"'
Publikováno v:
International Symposium on Microelectronics. 2019:000373-000380
Thick film customers who require fine line resolution for their circuitry typically utilize wet chemical etching as a means to reduce conductor's lines and spaces when fine line definition cannot be reliably attained with screen printing alone. Wet c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c3ffd743908267960424ed64db2a073
https://doi.org/10.4071/2380-4505-2019.1.000373
https://doi.org/10.4071/2380-4505-2019.1.000373
Publikováno v:
International Symposium on Microelectronics. 2018:000310-000316
For decades, polymer thick-film (PTF) systems have provided a low cost, non-fired option for screen-printing simple electronic circuits. The ability to apply these types of pastes on temperature sensitive substrates such as PET, polycarbonate, polyim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f92810686cd37962372b9f4ae32909c7
https://doi.org/10.4071/2380-4505-2018.1.000310
https://doi.org/10.4071/2380-4505-2018.1.000310
Publikováno v:
International Symposium on Microelectronics. 2018:000620-000627
The thick film paste manufacturers are expected to produce conductors which are lead and cadmium free, yet have excellent fired film properties and the same performance and properties as the cadmium and lead containing formulations. The fired film su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01e2e8c4003a29088131d56777268994
https://doi.org/10.4071/2380-4505-2018.1.000620
https://doi.org/10.4071/2380-4505-2018.1.000620
Publikováno v:
International Symposium on Microelectronics. 2016:000573-000580
Light-emitting diodes (LEDs) are the product of choice for many commercial and industrial lighting applications. Due to increasing power densities, alternative mounting solutions are being evaluated in order to achieve the lowest junction temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95cad3cb51956e5c787c69e11ed062a6
https://doi.org/10.4071/isom-2016-thp22
https://doi.org/10.4071/isom-2016-thp22
Autor:
Paul Gundel, Ryan Persons
Publikováno v:
International Symposium on Microelectronics. 2015:000330-000335
In the power electronics world, Direct Bonded Copper (DBC) is the primary substrate technology. In this paper, we will discuss an alternative technology utilizing screen printable copper pastes (Thick Printed Copper - TPC) on a variety of substrate t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67688be618784ef9a70c7944a681a637
https://doi.org/10.4071/isom-2015-wp12
https://doi.org/10.4071/isom-2015-wp12
Autor:
Torsten Nowak, Melanie Bawohl, Caitlin Shahbazi, Jessica Reitz, Ilias Nikolaidis, Ryan Persons, Mark Challingsworth, Christoph Czwickla, Christina Modes, Paul Gundel, Virginia C. Garcia
Publikováno v:
2016 IEEE Applied Power Electronics Conference and Exposition (APEC).
This paper presents Thick Printed Copper (TPC) as substrate technology for High Brightness LEDs, which features a strongly improved reliability combined with a significant cost advantage over incumbent technologies for High Brightness LED substrates.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b53168939329e91f910caadeb9e238d
https://doi.org/10.1109/apec.2016.7468301
https://doi.org/10.1109/apec.2016.7468301
Publikováno v:
International Symposium on Microelectronics. 2012:001178-001184
One of the most important contributing factors in the long life of LEDs (Light Emitting Diode) is keeping them cool, i.e., lowering the junction temperature, which can get as high as 150 °C. One way to accomplish this when building a circuit contain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e127034f33172273c0c14cea8c1b2a15
https://doi.org/10.4071/isom-2012-thp52
https://doi.org/10.4071/isom-2012-thp52
Publikováno v:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In the recent few years, high power electronic becomes one of the fastest growing market segments of semiconductor industry, because of the strong demand of high energy conversion efficiency and low energy loss, for the green environment protection.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ba47d5368c0cfe5f9130fdff9861e28
https://doi.org/10.1109/impact.2014.7048425
https://doi.org/10.1109/impact.2014.7048425