Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Ryan Gary Kim"'
Publikováno v:
Journal of Low Power Electronics and Applications, Vol 10, Iss 4, p 30 (2020)
Due to the amount of data involved in emerging deep learning and big data applications, operations related to data movement have quickly become a bottleneck. Data-centric computing (DCC), as enabled by processing-in-memory (PIM) and near-memory proce
Externí odkaz:
https://doaj.org/article/3144f841d4a24d2c9e7e2bacc88074c9
Autor:
Ryan Gary Kim, Shouvik Musavvir, Anwesha Chatterjee, Partha Pratim Pande, Janardhan Rao Doppa
Publikováno v:
ACM Journal on Emerging Technologies in Computing Systems. 17:1-19
Voltage/frequency island (VFI)-based power management is a popular methodology for designing energy-efficient manycore architectures without incurring significant performance overhead. However, monolithic 3D (M3D) integration has emerged as an enabli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82fda7b2a6b5108ce5fa02c541690659
https://doi.org/10.1145/3430765
https://doi.org/10.1145/3430765
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28:686-699
Monolithic 3-D (M3D) technology enables high density integration, performance, and energy efficiency by sequentially stacking tiers on top of each other. M3D-based network-on-chip (NoC) architectures can exploit these benefits by adopting tier partit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b76a63a76f55d151d815bd5b45a4cb4
https://doi.org/10.1109/tvlsi.2019.2954770
https://doi.org/10.1109/tvlsi.2019.2954770
Autor:
Partha Pratim Pande, Janardhan Rao Doppa, Diana Marculescu, Ryan Gary Kim, Biresh Kumar Joardar, Radu Marculescu
Publikováno v:
IEEE Transactions on Computers. 68:852-866
The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms, high-performance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::50b7d35ee6dc19ae1dbf261b86e89ccd
https://doi.org/10.1109/tc.2018.2889053
https://doi.org/10.1109/tc.2018.2889053
Publikováno v:
DAC
By lowering the number of vertical connections in fully connected 3D networks-on-chip (NoCs), partially connected 3D NoCs (PC-3DNoCs) help alleviate reliability and fabrication issues. This paper proposes a novel, adaptive congestion- and energy-awar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f7e3beeada9885d5b798825c7d3abe10
http://arxiv.org/abs/2102.08323
http://arxiv.org/abs/2102.08323
Autor:
Ryan Gary Kim
Publikováno v:
ISQED
As systems grow in specialization (e.g., domain specific architectures), we need the tools to handle the growing design space from increased heterogeneity and system sizes. In this paper, we investigate the specific challenges posed by heterogeneous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68bab27449cc9a07171cd3f8d96c4f0e
https://doi.org/10.1109/isqed48828.2020.9137000
https://doi.org/10.1109/isqed48828.2020.9137000
Autor:
Janardhan Rao Doppa, Dae Hyun Kim, Partha Pratim Pande, Shouvik Musavvir, Anwesha Chatterjee, Ryan Gary Kim
Publikováno v:
DATE
Monolithic 3D (M3D) technology enables unprecedented degrees of integration on a single chip. The miniscule monolithic inter-tier vias (MIVs) in M3D are the key behind higher transistor density and more flexibility in designing circuits compared to c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a32dc365d54198bc3cf1d0dddce5280
https://doi.org/10.23919/date48585.2020.9116345
https://doi.org/10.23919/date48585.2020.9116345
Autor:
Dae Hyun Kim, Partha Pratim Pande, Janardhan Rao Doppa, Biresh Kumar Joardar, Ryan Gary Kim, Aqeeb Iqbal Arka
Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of disparate comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9cc30f45e7142a22aad4817e19133232
Publikováno v:
Journal of Low Power Electronics and Applications, Vol 10, Iss 30, p 30 (2020)
Due to amount of data involved in emerging deep learning and big data applications, operations related to data movement have quickly become the bottleneck. Data-centric computing (DCC), as enabled by processing-in-memory (PIM) and near-memory process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f35f52a9e2adab13df038f5e3bf8fd99
Autor:
Wonje Choi, Partha Pratim Pande, Zhuo Chen, Janardhan Rao Doppa, Ryan Gary Kim, Diana Marculescu, Radu Marculescu
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 25:2458-2471
Manycore chips are widely employed in high-performance computing and large-scale data analysis. However, the design of high-performance manycore chips is dominated by power and thermal constraints. In this respect, voltage–frequency island (VFI) is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fedb0a4ac68bbffea0cbfdd4a5f6a68
https://doi.org/10.1109/tvlsi.2017.2700726
https://doi.org/10.1109/tvlsi.2017.2700726