Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ryan Edmonds"'
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Bump processing is a very common, cost-effective packaging technique which requires thick (>1 µm) AlCu top metal deposition. Use of this thicker metal has led to numerous process integration and defect inspection challenges. Several problems lurk at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37e6417ad4212a76ae9f60bc57124c76
https://doi.org/10.1109/asmc.2019.8791744
https://doi.org/10.1109/asmc.2019.8791744
Autor:
Carl Waterson, David M. Haddleton, Adam P. Jarvis, Sébastien Perrier, Andrew Marsh, Afzal Khan, Ryan Edmonds, Stuart G. Jackson, Dax Kukulj, Alex M. Heming, Elizabeth J. Kelly, Stefan Antonius Franciscus Bon
Publikováno v:
Macromolecular Symposia. 157:201-208
The use of copper(I) Schiff base complex catalysed atom transfer polymerisation of methacrylates is described. The use of a range of functional and multi-functional initiators enables the synthesis of a range of functional and star polymers to be pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44da1b4e892902779445fa1e356a773c
https://doi.org/10.1002/1521-3900(200007)157:1<201::aid-masy201>3.0.co
https://doi.org/10.1002/1521-3900(200007)157:1<201::aid-masy201>3.0.co
Autor:
Ryan Edmonds
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fadd4e0cf5a4b6f85370df91342f793
https://doi.org/10.2139/ssrn.1737931
https://doi.org/10.2139/ssrn.1737931
Autor:
Ryan Edmonds
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7f89003841882282cf262dea1ecaa2a
https://doi.org/10.2139/ssrn.1737944
https://doi.org/10.2139/ssrn.1737944