Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Ryan Chiu"'
Publikováno v:
Interdisciplinary Neurosurgery, Vol 27, Iss , Pp 101390- (2022)
Malignant cerebral edema is a common and devastating consequence of ischemic stroke that could necessitate decompressive hemicraniectomy to prevent herniation. Multiple randomized control trials have reported the utility of this surgery in reducing m
Externí odkaz:
https://doaj.org/article/76ab625833fd458a9fa510e25d7a22de
Autor:
Takuya Ogami, MD, Eric Zimmermann, MD, Ryan Chiu, MBA, MD, Louis Sussman, MD, Dimitrios V. Avgerinos, MD, PhD
Publikováno v:
JACC: Case Reports, Vol 2, Iss 5, Pp 828-829 (2020)
Primary cardiac tumors are rare and leiomyosarcoma is an even rarer entity with a reported incidence of
Externí odkaz:
https://doaj.org/article/e684f413a4c345539a71f7e4a222cdff
Autor:
Michael Safani, Steve Appleby, Ryan Chiu, Emmanuel J Favaloro, Emanuel T. Ferro, Jimmy Johannes, Milan Sheth
Publikováno v:
Expert Review of Hematology. 16:1-8
Autor:
Mike Tsai, Wynn Li, Ethan Ding, Tim Chang, Kevin Chang, Karina Chang, Eric He, J. Y. Chen, Rios Hsieh, Ryan Chiu, James Lin
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Mike Tsai, Ryan Chiu, James Lin, Yuan Jie, Azure Lin, Eddie Zheng, Jason Tsai, Bruce Lin, Ming-Fan Tsai, Erico Yang, J. Y. Chen
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Double Side SiP is hot packaging solution by using double side SMT technology and dual side molding to shrink the overall module size. The calculation of package size can be reduce over 40% PCB placement area from 8 x 8mm to 6 x 6mm. Based on module
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
5G era is coming, mobile devices with high performance and high duration ability have been common requirement in recent years. By shrinking PCB size to enlarge battery size seems like a simple way. However, there will be more and more components inte
Autor:
Frank Chu, Yu-Po Wang, Mike Tsai, Jay Li, Alex Hsieh, Shunyu Jian, J. Y. Chen, Eric He, Ming-fan Tsai, Simon Chen, Ryan Chiu
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The 5G revolution have brought about the huge impact for the communication industry which produces a series of innovative technologies, such as Sub 6Ghz and millimmeter wave (mmWave) 28Ghz spectrum, beam forming, multiconnectivity and edge computing
Autor:
Mike Tsai, Jensen Tsai, Simon Chen, Ryan Chiu, J. Y. Chen, Shunyu Jian, Eric He, Yu-Po Wang, Frank Chu
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Recently, the high growing semiconductor is the Internet of Things (IoT) and fifth generation (5G) connectivity application. Based on 5G, the different working frequency between sub 6GHz and millimeter wave (mmWave) frequency range on 28GHz and 39GHz
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Along with the rapid spread of portable electronic products on the mobile computing market, the increase in the use of video streaming, photo sharing and also other data-intensive applications keep growing up continuously for now. More and more IoT/W