A capacitive microphone with polysilicon membranes

Autor: Torkkeli, A., Saarilahti, J., Seppa, H., Sipola, H., Rusanen, O., Hietanen, J.

Publikováno v: Eurosensors XIII, 57-60
STARTPAGE=57;ENDPAGE=60;TITLE=Eurosensors XIII

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=narcis______::3b11e65725ab376c9b9712816d9c526d
https://research.utwente.nl/en/publications/a-capacitive-microphone-with-polysilicon-membranes(041dde0d-6018-4329-ae96-017ba6ea6d51).html

An investigation of sealant materials for display modules subjected to temperature and humidity conditions.

Autor: Griffin, P., Leahy, J.J., Punch, J., Galkin, T., Elonen, E., Rusanen, O.

Publikováno v: 4th IEEE International Conference on Polymers & Adhesives in Microelectronics & Photonics, 2004. POLYTRONIC 2004; 2004, p242-250, 9p

Modelling of ICA creep properties.

Autor: Rusanen, O.

Publikováno v: 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing. Proceedings Presented at Adhesives in Electronics 2000 (Cat. No.00EX431); 2000, p194-198, 5p

Packaging induced stresses in a packaged micromechanical microphone.

Autor: Rusanen, O., Torkkeli, A., Vahakangas, J.

Publikováno v: Proceedings 4th International Symposium on Advanced Packaging Materials Processes, Properties & Interfaces (Cat No98EX153); 1998, p161-164, 4p

Adhesive flip chip bonding in a miniaturised spectrometer.

Autor: Rusanen, O., Keranen, K., Blomberg, M., Lehto, A.

Publikováno v: Proceedings The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat No97TH8268); 1997, p95-100, 6p