Zobrazeno 1 - 10
of 83
pro vyhledávání: '"Ruohe Yao"'
Autor:
Jiesheng Liu, Meizhen Xiao, Xiao He, Wenxiao Fang, Weiheng Shao, Quan Huang, Guoguang Lu, Lei Wang, Yun Huang, Yunfei En, Ruohe Yao
Publikováno v:
IET Microwaves, Antennas & Propagation, Vol 15, Iss 5, Pp 464-473 (2021)
Abstract A magnetic near‐field probe (H‐field probe) with dual output has been developed using a four‐layer printed circuit board (PCB) technique. To achieve the improvement of detection sensitivity, the symmetrical double‐loop is adopted to
Externí odkaz:
https://doaj.org/article/89936e6735a0476b8503c5528925085c
Publikováno v:
IEEE Access, Vol 8, Pp 101834-101839 (2020)
We fabricated high-performance InSnZnO (ITZO) thin-film transistors (TFTs) with self-assembled monolayers (SAMs)/Al2O3 double passivation layers (PVLs). The presented SAMs/Al2O3 double passivation leads to high-performance ITZO TFTs with a steep subt
Externí odkaz:
https://doaj.org/article/789aec120900450c9abf5464dd485b82
Publikováno v:
Tongxin xuebao, Vol 40, Pp 19-29 (2019)
A novel predictive channel scheduling algorithm was proposed for non-real-time traffic transmission between macro-base stations and micro-base stations in 5G ultra-cellular networks.First,based on the stochastic stationary process characteristics of
Externí odkaz:
https://doaj.org/article/af9eb73cb2674f40929a8dcb0d726e9e
Autor:
Xing Fu, Min Liu, KeXin Xu, Si Chen, YiJun Shi, ZhiWei Fu, Yun Huang, HongTao Chen, RuoHe Yao
Publikováno v:
Materials, Vol 13, Iss 23, p 5497 (2020)
The in-situ observation of Sn-3.0Ag-0.5Cu solder joints under electromigration was conducted to investigate the microstructure and grain orientation evolution. It was observed that there was a grain rotation phenomenon during current stressing by in-
Externí odkaz:
https://doaj.org/article/46c8bd323ca6432f9687e00ab061a00f
Publikováno v:
Applied Sciences, Vol 9, Iss 17, p 3458 (2019)
We demonstrate that the concave-convex circular composite structure sidewall prepared by inductively coupled plasma (ICP) etching is an effective approach to increase the light efficiency without deteriorating the electrical characteristics for micro
Externí odkaz:
https://doaj.org/article/5598489f688c4f2e84b5b2a1c8e72c53
Publikováno v:
Materials, Vol 12, Iss 10, p 1593 (2019)
Electromigration was characterized at the cathode Cu/solder interface—without the effect of Joule heating—by employing scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) analyses. Rapid (Cux,Ni1−x)6Sn5 intermetallic
Externí odkaz:
https://doaj.org/article/edca4f855f7641878235c4ee9819bba5
Publikováno v:
Applied Sciences, Vol 9, Iss 2, p 353 (2019)
In this paper, we characterized and compared signal transmission performances of traces with different specifications of fiber weave. Measurements demonstrated that the dielectric constant, impedance fluctuation, and differential skew were all affect
Externí odkaz:
https://doaj.org/article/f349c80b5c4b48e09b4135d95e25b4cf
Publikováno v:
Current Nanoscience. 19
Background: The development of high-performance piezoelectric pressure sensors with outstanding sensitivity, good linearity, flexibility, durability, and biocompatibility is of great significance for smart robotics, human healthcare devices, smart se
Publikováno v:
IEEE Sensors Journal. 22:12613-12621
Publikováno v:
Solar RRL.