Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Ruoh-Huey Uang"'
On the Thermal–Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:546-563
Extensive understanding and management of the thermal-mechanical characteristics of novel packaging designs during the bonding process are indispensable to the realization of the technologies. Thus, this paper attempts to explore the bonding process-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::762791437ce493d1a2d565915c3b5cd2
https://doi.org/10.1109/tadvp.2009.2013725
https://doi.org/10.1109/tadvp.2009.2013725
Publikováno v:
Composites Science and Technology. 68:3388-3395
The study attempts to evaluate the complete set of effective transversely isotropic properties of a nanocomposite at various nanofiber-volume fractions through effective continuum modeling and experimental testing. The investigation starts from the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::362c9f16d7d0b0446ce06980e045d389
https://doi.org/10.1016/j.compscitech.2008.09.030
https://doi.org/10.1016/j.compscitech.2008.09.030
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:404-409
This paper demonstrates a flux/2-ethyl-1-hexanol mixture capable of performing a self-assembly process. An /Ar plasma treatment controls the surface free energy of Si, leading to better self-assembly driven by capillary force. Hydrophobic bonding pad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bcc6a7ce5446095ba21e36a3d125b1d
https://doi.org/10.1109/tadvp.2008.923383
https://doi.org/10.1109/tadvp.2008.923383
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
This paper aims at developing an effective scheme for design optimization of a novel nanocomposite-typed flip chip (FC) technology, constructed by integrating an Ag-nanowire/polymer nanocomposite film together with a nonconductive paste (NCP) technol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::555a6933e45d9d35c934e6f599f36385
https://doi.org/10.1109/impact.2009.5382287
https://doi.org/10.1109/impact.2009.5382287
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan.
The process-induced thermal-mechanical behaviors of the np ACF typed FC technology during bonding process and temperature variation are investigated. For achieving the goal, a process-dependent simulation methodology is introduced, which incorporates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8dab31e9b0dfbb9cbbac150e5b70c57
https://doi.org/10.1109/impact.2006.312214
https://doi.org/10.1109/impact.2006.312214
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9c978a6064fa23102dbf35b8b008370
https://doi.org/10.1109/ectc.2005.1441247
https://doi.org/10.1109/ectc.2005.1441247
Autor:
Yu-Chih Chen, Yung-Yu Hsu, Ruoh-Huey Uang, Chao-Ta Huang, Syh-Yuh Cheng, Rong-Chang Fan, Ren-Jen Lin
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
As the prediction that the I/O pitch will decrease from 60 um in 2004 to 20 um beyond 2010 by ITRS roadmap, flip chip interconnection by traditional ACF containing conductive particles with micro-meter size will face more and more challenges. One of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce73175993e30def71dd7277d1114750
https://doi.org/10.1109/eptc.2004.1396589
https://doi.org/10.1109/eptc.2004.1396589
Autor:
Shu-Ming Chang, Hsu-Tien Hu, Ruoh-Huey Uang, Yu-Fang Chen, Yu-Hua Chen, Dau-Chi Liou, Kuo-Chuan Chen
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::839197f6cbb5ba205dc8c7947c74c70f
https://doi.org/10.1109/ectc.2003.1216446
https://doi.org/10.1109/ectc.2003.1216446
Autor:
Jyh-Rong Lin, Yu-Jiau Hwang, Hsu-Tien Hu, Yu-Chih Chen, Ruoh-Huey Uang, Kuo-Chuan Chen, Shu-Ming Chang
Publikováno v:
4th Electronics Packaging Technology Conference, 2002..
Recently, flip chip package has obtained more and more attentions due to its benefits of high I/O, low inductance and better thermal dissipation. Therefore flip chip package is getting to be used in some high performance and high speed devices such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e3bd4aa358d807930abc4ee03a6ad7c
https://doi.org/10.1109/eptc.2002.1185680
https://doi.org/10.1109/eptc.2002.1185680
Autor:
Yuh-Jiau Huang, Hsu-Tien Hu, Yu-Fang Chen, Ruoh-Huey Uang, Hsin-Chien Huang, Szu-Wei Lu, Zhao-Hui Wu, Ling-Chen Kung, Wei-Chung Lo
Publikováno v:
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).
In this paper, we describe the process control of high-density solder bumps by electroplating with high uniformity and repeatability. The die size is 10/spl times/10 mm and it has 1,520 total I/Os. The electroplated bump is composed of eutectic Sn/Pb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec1a4016aa27574307f4ebdec5232569
https://doi.org/10.1109/iemt.1999.804840
https://doi.org/10.1109/iemt.1999.804840