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pro vyhledávání: '"Ruey-Chyi Wu"'
Autor:
Ruey-Chyi Wu, 吳瑞琦
95
Yield enhancements are always the key factor among competitors in the semiconductor packaging industry. In view of this, this paper attempts to construct a quality improvement system to increase process yield. Case study focuses mainly on the
Yield enhancements are always the key factor among competitors in the semiconductor packaging industry. In view of this, this paper attempts to construct a quality improvement system to increase process yield. Case study focuses mainly on the
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/17031167157325375036
Autor:
Ruey-Chyi Wu, 吳瑞琦
81
Traditional File systems are liable to some shortcomings: inconsistent data names, inconsistent field lengths, inconsistent file layouts and so forth. It is important to enforce data administration to solve these problems before we apply data
Traditional File systems are liable to some shortcomings: inconsistent data names, inconsistent field lengths, inconsistent file layouts and so forth. It is important to enforce data administration to solve these problems before we apply data
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/48326354031506806183
Autor:
Yu-Liang Liu, Ruey-Chyi Wu
Publikováno v:
IEICE Transactions on Information and Systems. :2771-2780
Publikováno v:
IIE Transactions. Jan2006, Vol. 38 Issue 1, p39-51. 13p. 6 Diagrams, 15 Charts, 2 Graphs.
Publikováno v:
COMPSAC (2)
First, we classify the selected customers into clusters using RFM model to identify high-profit, gold customers. Subsequently, we carry out data mining using association rules algorithm. We measure the similarity, difference and modified difference o
Publikováno v:
Sixth International Conference on Software Engineering, Artificial Intelligence, Networking & Parallel/Distributed Computing & First ACIS International Workshop on Self-Assembling Wireless Network; 2005, p70-75, 6p
Autor:
Ruey-Chyi Wu1 rcwu@moeaidb.gov.tw, Ruey-Shun Chen1 rschen@iim.nctu.edu.tw, Fan, C.R.1 david@ms85.url.com.tw
Publikováno v:
International Journal of Materials & Product Technology. 2004, Vol. 21 Issue 6, p1-1. 1p.
Publikováno v:
29th Annual International Computer Software & Applications Conference (COMPSAC'05); 2005, p39-39, 1p