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pro vyhledávání: '"Rudy Salas"'
Autor:
Eric Macdonald, Rudy Salas, David Espalin, Mireya Perez, Efrain Aguilera, Dan Muse, Ryan B. Wicker
Publikováno v:
IEEE Access, Vol 2, Pp 234-242 (2014)
In new product development, time to market (TTM) is critical for the success and profitability of next generation products. When these products include sophisticated electronics encased in 3D packaging with complex geometries and intricate detail, TT
Externí odkaz:
https://doaj.org/article/7f3f624ae53449b8a1fcd0b9a7294356
Autor:
Dan Muse, Michael D. Irwin, Cassie Gutierrez, Rudy Salas, Ryan B. Wicker, Brian Zufelt, Eric MacDonald, Mike Newton, Gustavo Hernandez, Kenneth Church, Richard Olivas
Publikováno v:
Scopus-Elsevier
Fabricating entire systems with both electrical and mechanical content through on-demand 3D printing is the future for high value manufacturing. In this new paradigm, conformal and complex shapes with a diversity of materials in spatial gradients can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d233a39f7d80b7f4c9cc7cf30ed79ee8
http://www.scopus.com/inward/record.url?eid=2-s2.0-84879936972&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-84879936972&partnerID=MN8TOARS
Autor:
Eric MacDonald, Kenneth Church, Richard Olivas, Ryan B. Wicker, Dan Muse, Rudy Salas, Mike Newton
Publikováno v:
Scopus-Elsevier
Implementing electronics systems that are conformal with curved and complex surfaces is difficult if not impossible with traditional fabrication techniques, which require stiff, two dimensional printed circuit boards (PCB). Flexible copper based fabr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::253f46f5e6fe69e854ee74771c4626f4
http://www.scopus.com/inward/record.url?eid=2-s2.0-84878184669&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-84878184669&partnerID=MN8TOARS