Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ruben Kahle"'
Autor:
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow
Publikováno v:
Micromachines, Vol 10, Iss 5, p 342 (2019)
Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redist
Externí odkaz:
https://doaj.org/article/e2b6112aff9547aeadb5c5f6008536a1
Autor:
Tanja Braun, Ole Holck, Mattis Obst, Steve Voges, Ruben Kahle, Lars Bottcher, Mathilde Billaud, Lutz Stobbe, Karl-Friedrich Becker, Rolf Aschenbrenner, Marcus Voitel, Friedrich-Leonhard Schein, Lutz Gerholt, Martin Schneider-Ramelow
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::887a6880363d374ec8b9f1a684099501
https://doi.org/10.1109/ectc51906.2022.00133
https://doi.org/10.1109/ectc51906.2022.00133
Autor:
Friedrich-Leonhard Schein, Christian Voigt, Lutz Gerhold, Ioannis Tsigaras, Mohamed Elghazzali, Hirofumi Sawamoto, Ewald Strolz, Roland Rettenmeier, Ruben Kahle, Lars Bottcher
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8702bfc753c646f9a81daead964286f9
https://doi.org/10.1109/ectc51906.2022.00242
https://doi.org/10.1109/ectc51906.2022.00242
Autor:
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Pascal Graap, Markus Wohrmann, R. Aschenbrenner, Marc Dreissigacker, Martin Schneider-Ramelow, Klaus-Dieter Lang
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
As mobile devices have become ubiquitous, also a large number of integrated sensors have entered our daily life. And with every new generation of mobiles the number of sensors increases, forming a growing market. Applications range from consumer to a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34d15bba78ae28f4f1792a707200d324
https://doi.org/10.1109/ectc.2019.00135
https://doi.org/10.1109/ectc.2019.00135