Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ruben F. Santos"'
Publikováno v:
Applied Sciences, Vol 12, Iss 19, p 9778 (2022)
The development of new materials for the electronics industry has been in focus in recent years, as circuit miniaturization poses challenges for conventional solutions. Dewetting of Cu films over diffusion-barrier layers has fostered an interest in d
Externí odkaz:
https://doaj.org/article/9b1a7a411df24590ba9a769ad567eafe
Publikováno v:
Nanomaterials, Vol 12, Iss 10, p 1752 (2022)
The back-end-of-line (BEOL) copper interconnect structure has been subjected to downscaling for the last two decades, while the materials used for conforming and assuring its physical integrity during processing have faced significant obstacles as th
Externí odkaz:
https://doaj.org/article/ef291d08da064ed8a64b1adfddc41563
Autor:
Rúben F. Santos, Bruno M. C. Oliveira, Alexandre Chícharo, Pedro Alpuim, Paulo J. Ferreira, Sónia Simões, Filomena Viana, Manuel F. Vieira
Publikováno v:
Nanomaterials, Vol 11, Iss 8, p 1914 (2021)
The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable el
Externí odkaz:
https://doaj.org/article/f15e84b333ae455992b0637a6dfb0338