Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Roy Koret"'
Autor:
Alain Moussa, Janusz Bogdanowicz, Benjamin Groven, Pierre Morin, Matteo Beggiato, Mohamed Saib, Gaetano Santoro, Yaniv Abramovitz, Kevin Houtchens, Shmuel Ben Nissim, Noga Meir, Joey Hung, Adam M. Urbanowicz, Roy Koret, Igor Turovets, Gian Francesco Lorusso, Anne-Laure Charley
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2d4816ee1ae6392a25060d9b03288ac
https://doi.org/10.1117/12.2657968
https://doi.org/10.1117/12.2657968
Autor:
Daniel Schmidt, Manasa Medikonda, Michael Rizzolo, Claire Silvestre, Julien Frougier, Andrew Greene, Mary Breton, Aron Cepler, Jacob Ofek, Itzik Kaplan, Roy Koret, Igor Turovets
Publikováno v:
Journal of Micro/Nanopatterning, Materials, and Metrology. 22
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efec40642400718dad045060d2eddd91
https://doi.org/10.1117/1.jmm.22.3.031203
https://doi.org/10.1117/1.jmm.22.3.031203
Autor:
Manasa Medikonda, Daniel Schmidt, Michael Rizzolo, Mary A. Breton, Ashim Dutta, Heng Wu, Eric R. Evarts, Aron Cepler, Roy Koret, Igor Turovets, Daniel Edelstein
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e93f16c9d6111c417e941fae52fc155a
https://doi.org/10.1117/12.2614137
https://doi.org/10.1117/12.2614137
Autor:
Daniel Schmidt, Manasa Medikonda, Michael Rizzolo, Claire Silvestre, Julien Frougier, Andrew Greene, Mary A. Breton, Aron Cepler, Jacob Ofek, Itzik Kaplan, Roy Koret, Igor Turovets
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b7df66fb6830c90dae8516a7276ceb8
https://doi.org/10.1117/12.2614077
https://doi.org/10.1117/12.2614077
Autor:
Daniel Schmidt, Aron Cepler, Curtis Durfee, Shanti Pancharatnam, Julien Frougier, Mary Breton, Andrew Greene, Mark Klare, Roy Koret, Igor Turovets
Methodologies for characterization of the lateral indentation of silicon-germanium (SiGe) nanosheets using different non-destructive and in-line compatible metrology techniques are presented and discussed. Gate-all-around nanosheet device structures
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a0b883d3edd86a617680648728b9db75
Autor:
Igor Turovets, Jennifer Fullam, Mary Breton, Roy Koret, Karen Petrillo, Daniel Schmidt, Aron Cepler
Publikováno v:
2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Comprehensive EUV resist characterization for line and space patterns at pitches between 32 and 40 nm using scatterometry in conjunction with machine learning algorithms is presented and discussed. Controlled experimental variations of EUV single exp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::751e641cba50434e9d41a5b8b6f0cbc6
https://doi.org/10.1109/asmc51741.2021.9435698
https://doi.org/10.1109/asmc51741.2021.9435698
Autor:
Roy Koret, Gilad Belkin, Manasa Medikonda, Shay Wolfling, Curtis Durfee, Frougier Julien, Andrew M. Greene, Roy Shtainman, Daniel Schmidt, Igor Turovets, Dror Shafir, Aron Cepler, Shanti Pancharatnam
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
In this work, the novel enhancement to multichannel scatterometry data collection, Spectral Interferometry, is introduced and discussed. The Spectral Interferometry technology adds unique spectroscopic data by providing absolute phase information. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e27002f53f90e40c11a555e03b1c492
https://doi.org/10.1117/12.2582364
https://doi.org/10.1117/12.2582364
Autor:
Daniel Schmidt, Igor Turovets, Veeraraghavan S. Basker, Andrew M. Greene, Frougier Julien, Mary Breton, Aron Cepler, Marjorie Cheng, Dexin Kong, Nicolas Loubet, Mark Klare, Roy Koret, Jingyun Zhang, Abraham Arceo de la Pena, Ishtiaq Ahsan
Publikováno v:
2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
The methodology of measuring the lateral etch, or indentation, of SiGe nanosheets by using optical scatterometry, x-ray fluorescence, and machine learning algorithms is presented and discussed. Stacked nanosheet device structures were fabricated with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3f7a2fb31f627b7d8b01b43a56fe6d4
https://doi.org/10.1109/asmc49169.2020.9185226
https://doi.org/10.1109/asmc49169.2020.9185226
Autor:
Vanessa Zhang, Igor Turovets, Kavita Shah, Roy Koret, Silvia Armini, Rob Ameloot, Joey Hung, Laxmi Warad, Srinivasan Rangarajan, Mikhail Krishtab
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
The native self-alignment of area-selective deposition (ASD) processes makes this technology a promising solution for precise pattern positioning in the EUV era. The key challenge for any ASD process is its defectivity associated with the deposition
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2db827bee2d83c41153bec97d33d58b
https://doi.org/10.1117/12.2551492
https://doi.org/10.1117/12.2551492
Autor:
Shay Wolfling, Joey Hung, Philippe Leray, Frederic Lazzarino, Anne-Laure Charley, Avron Ger, Alain Moussa, Roy Koret, Gayle Murdoch, Sara Paolillo
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIV.
Beyond the 5nm technology node, interconnect scaling has an impact on metal material selection: usage of copper may hit a limit with respect to resistance and reliability performance [1]. Thickness of barrier and liner (required for copper) cannot be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cfe6bf3d93decdccbf3878d34c900fa
https://doi.org/10.1117/12.2550366
https://doi.org/10.1117/12.2550366