Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Roumen Ratchev"'
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The cost- and time-efficient qualification process of solder joints in automotive electronic assemblies requires accelerated temperature cycling (ATC) testing. Such tests, aiming to investigate durability of solder joints in increased temperature ran
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b19156f5ecb55364385b2ab17733e93b
https://doi.org/10.1109/eurosime48426.2020.9152198
https://doi.org/10.1109/eurosime48426.2020.9152198
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Green electronics for electrical driving or solar energy application need high temperature substrates because the next generation of power semiconductors is based on wide-bandgap semiconductors (WBG), e.g. GaN or SiC. These WBG materials support the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eaa1c9eeb8cf9968754b7b82b71a3bd3
https://doi.org/10.1109/ectc.2018.00191
https://doi.org/10.1109/ectc.2018.00191
Publikováno v:
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The paper presents experimental results on tin-based solder alloys to their mechanical visco-plastic deformation behaviour under systematically investigation of cooling rates and their micro-structural solidification.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61ee3dfe2c7a47d3415f05f1de35dc99
https://doi.org/10.1109/eurosime.2015.7103159
https://doi.org/10.1109/eurosime.2015.7103159
Autor:
R. Metasch, Karsten Meier, Mike Roellig, Roumen Ratchev, B. Metais, A. Kabakchiev, K.-J. Wolter
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fed34417db166f51ac8d01eb7a87cc4c
https://doi.org/10.1109/eurosime.2014.6813860
https://doi.org/10.1109/eurosime.2014.6813860
Autor:
M. Hossfeld, Michael Guyenot, P. Buhl, Mike Roellig, B. Metais, R. Metasch, Roumen Ratchev, A. Kabakchiev, X. Schuler
Publikováno v:
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Automotive electronic devices are exposed to substantially harsher thermo-mechanical loads compared to commercial consumer electronic products. As a consequence, solder joints carrying out the electrical interconnection between the components undergo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a5ebf20f4ae8223c80f64c379d702b2
https://doi.org/10.1109/eurosime.2014.6813771
https://doi.org/10.1109/eurosime.2014.6813771
Publikováno v:
Proceedings of the 36th International Spring Seminar on Electronics Technology.
When exposed to harsh and humid environments, electronic systems can show electrochemical corrosion. One of the possible defects is Conductive Anodic Filament (CAF). This defect needs the presence of humidity. Though the moisture uptake of printed ci
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f23f17e203264fb0844b8e79238797d8
https://doi.org/10.1109/isse.2013.6648227
https://doi.org/10.1109/isse.2013.6648227
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
To meet the increasing lifetime requirements of solder joints in thermal cycling, the coefficient of thermal expansion (CTE) of the printed circuit board (PCB) has to be conformed to the CTE of the surface mounted devices (SMD). Novel reinforcing fab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c30102f6b37af63197fdace16d37eceb
https://doi.org/10.1109/estc.2012.6542181
https://doi.org/10.1109/estc.2012.6542181
Publikováno v:
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
This study presents a method to predict lifetime of SMD lead free solder joints submitted to vibrations. An experimental method is presented to test chip resistors under vibrations. A specially designed testboard allows testing several specimens simu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ff25adaaabc5bc5f628dc61cf9c598c
https://doi.org/10.1109/esime.2010.5464536
https://doi.org/10.1109/esime.2010.5464536
Publikováno v:
Kennwertermittlung für die Praxis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d70c2e5fc989eeecc539249703620e72
https://doi.org/10.1002/9783527610310.ch49
https://doi.org/10.1002/9783527610310.ch49
