Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Ross Havens"'
Autor:
Sada Patil, Jie Xue, Delacruz Javier A, Li Li, Jack Hellings, Marius Voicu, Mohan Nagar, Mark Coor, Bill Isaacson, Paul Ton, Pierre Chia, Ross Havens
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
To meet the requirements of the next high generation high-performance networking switches and routers, system integration based on the Three-dimensional (3D) System-in-Package (SiP) technology is being studied and developed. In this paper, we report
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ec238f3e8baca9392c0612cdde6ef97
https://doi.org/10.1109/ectc.2016.246
https://doi.org/10.1109/ectc.2016.246
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4edb64872adb7182dbe28e9cae62df4f
https://doi.org/10.1109/itherm.2014.6892427
https://doi.org/10.1109/itherm.2014.6892427
Autor:
Ross Havens, Krishnaswami Srihari, Ganesh Pandiarajan, Gurudutt Chennagiri, Satyanarayan Shivkumar Iyer
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
There is a continuous need for higher density memory modules for applications like servers, telecommunications, and networking. Memory modules with package stacked Dynamic Random-Access Memory (DRAM) devices were developed for these applications. Sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a98418f4c3d08bd8a748fbe45dbc41e
https://doi.org/10.1109/ectc.2013.6575816
https://doi.org/10.1109/ectc.2013.6575816
Autor:
Vikram Venkatadri, Daryl Santos, Krishnaswami Srihari, Santosh Kudtarkar, Ross Havens, P. Tumne, Michael D. Delaus
Publikováno v:
Journal of Electronic Packaging. 134
Today’s consumer market demands electronics that are smaller, faster, and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. Wafer level chip scale package (WLCSP) is one of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0105b4ef5075d17dc0f3af4fb1ee14bc
https://doi.org/10.1115/1.4005906
https://doi.org/10.1115/1.4005906
Autor:
Daryl Santos, Ross Havens, Xiaojie Xue, Dipak Sengupta, Krishnaswami Srihari, Mark Downey, Vikram Venkatadri
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
System-On-Film (SOF) module is a complex integration of a fine pitch high density die and surface mounted discrete devices on a polyimide (PI) film laminate. The die is connected to the film using a thermo-compression flip-chip bonding (TCB) process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3156cbd883b7637452f87c112f26631
https://doi.org/10.1115/ipack2011-52143
https://doi.org/10.1115/ipack2011-52143
Autor:
Daryl Santos, Pushkraj Tumne, Michael D. Delaus, Vikram Venkatadri, Ross Havens, Krishnaswami Srihari, Santosh Kudtarkar
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
Today’s consumer market demands electronics that are smaller, faster and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. Wafer Level Chip Scale Package (WLCSP) is one of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4020c57ade82ec632e73a82acc400cc7
https://doi.org/10.1115/ipack2011-52078
https://doi.org/10.1115/ipack2011-52078
Publikováno v:
Volume 4: Electronics and Photonics.
A Land Grid Array (LGA) is an area array component similar to a Ball Grid Array (BGA), but without solder balls attached to the bottom surface of the package. Due to the absence of solder balls, the LGA package has a lower thickness as compared to an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d602a72278424898641a32d41c09de92
https://doi.org/10.1115/imece2010-40899
https://doi.org/10.1115/imece2010-40899
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