Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Roshan Dodampola"'
Autor:
D.P. Egodage, Roshan Dodampola, A. Ratnakumar, Sampath C. Weragoda, D. A. S. Amarasinghe, A.M.P.B. Samarasekara, Dinesh Attygalle
Publikováno v:
2022 Moratuwa Engineering Research Conference (MERCon).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c674d833ec9c827f018712b01e3fa75
https://doi.org/10.1109/mercon55799.2022.9906178
https://doi.org/10.1109/mercon55799.2022.9906178
Publikováno v:
Materials Today: Proceedings. 23:2-7
Thermogravimetric (TG) and differential thermogravimetric (DTG) are the most commonly used analytical techniques to find the kinetic triplet of solid-state reactions. In this study, MATLAB® based computer simulation was used to investigate the DTG p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8fabd7a83107ce2868f7ffb43d1eec28
https://doi.org/10.1016/j.matpr.2019.05.298
https://doi.org/10.1016/j.matpr.2019.05.298
Autor:
Abirami Ratnakumar, Darshi Egodage, Roshan Dodampola, Don A.S. Amarasinghe, Dinesh Attygalle, Sampath Weragoda, Bandu Samarasekara
Publikováno v:
Macromolecular Symposia. 402:2100427
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd774d8de35a79cbc84b1afa71fa846a
https://doi.org/10.1002/masy.202100427
https://doi.org/10.1002/masy.202100427
Publikováno v:
2018 Moratuwa Engineering Research Conference (MERCon).
Though insulation is critical to the performance of an electrical cable the assessment of the status of an insulation is still a major challenge. Since the root cause of most electrical cable failures is due to insulation deterioration, if the rate o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2f422db75502e5472fa750337deebf9
https://doi.org/10.1109/mercon.2018.8421960
https://doi.org/10.1109/mercon.2018.8421960
Publikováno v:
2018 Moratuwa Engineering Research Conference (MERCon).
Integrated photonics will play an important role in future technologies and the advancement of optical integrated circuits (OICs) is unquestionably dependent on the ability to develop compact and reliable optical components at low cost. Here the auth
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::518940667d3e1f9444946817a0528d26
https://doi.org/10.1109/mercon.2018.8421991
https://doi.org/10.1109/mercon.2018.8421991