Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Rosemary Bell"'
Autor:
Jeff Kong, Robert K. Barr, Michael K. Gallagher, Colin Calabrese, Colin Hayes, Jennie Paik, Kevin Wang, Kirk Thompson, Lingyun Wei, Rosemary Bell
Publikováno v:
International Symposium on Microelectronics. 2019:000037-000041
Fifth generation network technology, often referred to as 5G, holds great potential for higher communication speeds, higher data transmission rates and improved connectivity, however, current dielectric materials lack sufficiently low dielectric loss
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03462756b17d0f72c97ea52b6fe964b8
https://doi.org/10.4071/2380-4505-2019.1.000037
https://doi.org/10.4071/2380-4505-2019.1.000037
Autor:
Hua Dong, Berry Paul, Janet Okada, Yil-Hak Lee, Matthew VanHanehem, Robert Auger, Paul Morganelli, Jonathan Prange, Ravi Pokhrel, Masaki Kondo, Ed Anzures, Michelle Ho, Joe Lachowski, Julia Kozhukh, Rosemary Bell, Michael K. Gallagher
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:001145-001164
As the electronics industry reaches the limits of lithographic processing at sub-10nm dimensions, alternate approaches to meet the demand for increasing device density, reducing package size and improving device performance are being explored. Die st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afa7dea64b3c6586cfed9e4693f05bb1
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_tha1_076
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_tha1_076
Autor:
Christian Ayala, Kevin Wang, Michael K. Gallagher, Colin Hayes, Corey Shay, Kirk Thompson, Keith Best, Rosemary Bell, Robert K. Barr, Colin Calabrese
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fifth Generation (5G) network and high speed/high frequency (HS/HF) technology is the key to setting higher transmission rates and improved connectivity but will require significant innovation from materials to enable the manufacturing and performanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f92904fbd8c4346ddc7bfb940310ce60
https://doi.org/10.1109/ectc32862.2020.00103
https://doi.org/10.1109/ectc32862.2020.00103
Autor:
Regina Cho, Yun-Hyeon Kim, Joseph F. Lachowski, Mark Lefebvre, Rosemary Bell, Inho Lee, Matthew Thorseth, Mitsuru Haga, Wataru Tachikawa, Mark Scalisi, Yi Qin, Jonathan Prange, yoon Joo Kim, Jeff Calvert
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-22
Advanced packaging technologies require materials which will allow for better resolution of patterns associated with the ever more challenging device architecture, along with materials that will allow for higher throughput. Device throughput can be i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e00aa1b68cdd4a77137240e75b10263e
https://doi.org/10.4071/2017dpc-wp1_presentation3
https://doi.org/10.4071/2017dpc-wp1_presentation3
Autor:
Matthew VanHanehem, Julia Kozhukh, Rosemary Bell, Michael K. Gallagher, Ed Anzures, Masaki Kondo
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
To maintain the industry goal of increasing performance with every new generation of technology it is necessary to further shrink the package size in the zdimension through the use of 3D-TSV and copper pillar structures. This approach will allow elec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::184b65f25428f7352e8556579a83ed4a
https://doi.org/10.1109/ectc.2018.00225
https://doi.org/10.1109/ectc.2018.00225
Autor:
Sue McNamara, Hua Dong, Jong-Uk Kim, Mike Gallagher, Aoude Tina, Bob Barr, Rosemary Bell, Joe Lachowski, Masaki Kondoh, Jeff Calvert, Joon-Seok Oh, Greg Prokopowicz, Louks David H
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000679-000697
As the semiconductor industry drives to more functionality in smaller and lighter devices, it requires new materials to meet the changing requirements of new and more advanced chip designs and packaging solutions. Photoimagable polymeric dielectric m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d16efd1bbfe424b74b41a2f06d46cda9
https://doi.org/10.4071/2015dpc-tp26
https://doi.org/10.4071/2015dpc-tp26
Autor:
Anupam Choubey, Hua Dong, Joe Lachowski, Jong-Uk Kim, Kai Zoschke, Masaki Kondo, Corey O'connor, Michael Toepper, Rosemary Bell, Christina Lopper, Dow Electronic Materials, Matthias Wegner, Michael K. Gallagher, Bob Barr, Fraunhofer Izm, Greg Prokopowicz
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000886-000912
The microelectronics industry is being continually challenged to decrease package size, lower power consumption and improve device performance for the mobile communication and server markets. In order to keep pace with these requirements, device manu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5da3fbf50eeff1ef568161ab9abc737
https://doi.org/10.4071/2014dpc-tp24
https://doi.org/10.4071/2014dpc-tp24
Autor:
Duane Romer, Sue McNamara, Greg Prokopowicz, Xiang Qian Liu, Mark S. Oliver, Seiji Inaoka, Matthew Yonkey, Rosemary Bell, Lynne K. Mills, Raymond Thibault, Joe Lachowski, Kevin Wang, Scott Kisting, Michael K. Gallagher, Kim Sang Ho, Eric Huenger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001559-001584
The advanced packaging application space continues to evolve as mobile devices pack more and more features into a limited space. This feature concentration is causing a deviation from the conventional shrinkage pathway predicted by Moore's law which,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ca910036b9c85a309d4086b9a24ff85
https://doi.org/10.4071/2013dpc-wp25
https://doi.org/10.4071/2013dpc-wp25
Autor:
Jong Keun Park, Yi Liu, Young Cheol Bae, Cecily Andes, Young Seok Kim, Thomas Cardolaccia, Seung-Hyun Lee, Jibin Sun, Rosemary Bell, Georgee G. Barclay
Publikováno v:
Journal of Photopolymer Science and Technology. 24:211-217
The effect of molecular weights of 193nm resist polymers on the negative tone development (NTD) process was studied in three different solvent developers. By optimizing the polymer structures for the NTD process, it was possible to improve the dissol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e4ddab1bb0901ff597c1682ffcf96f8
https://doi.org/10.2494/photopolymer.24.211
https://doi.org/10.2494/photopolymer.24.211
Sub 30nm Node Contact Hole Patterning Using Immersion Single Exposure with Negative Tone Development
Autor:
Seikho Kang, Lori Josesten, Ken Spizuoco, Mitchael Reilly, Rosemary Bell, Young Cheol Bae, Thomas Penniman
Publikováno v:
Journal of Photopolymer Science and Technology. 23:211-215
Contact hole patterning for 22nm node and beyond has become much more challenging. Since extreme ultraviolet lithography (EUV) is not yet ready, double patterning (DP) technology seems to be the most likely solution to achieve minimum half pitch of 4
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cd999cf2dc0ea7cbf7199487d0a65dc
https://doi.org/10.2494/photopolymer.23.211
https://doi.org/10.2494/photopolymer.23.211