Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Roseanne Duca"'
Autor:
Roseanne Duca
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b01046ce01446b28bbd07b4b4b85d4fc
https://doi.org/10.1109/eptc56328.2022.10013235
https://doi.org/10.1109/eptc56328.2022.10013235
Autor:
Roseanne Duca
Publikováno v:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::09c0a39974f5d398d88a8d8edf6fa169
https://doi.org/10.1109/iemt55343.2022.9969497
https://doi.org/10.1109/iemt55343.2022.9969497
Autor:
Lorenzo Codecasa, Alessandro Di Costanzo, Vincenzo d’Alessandro, Roseanne Duca, Donata Gualandris, Arianna Morelli, Francesca De Viti, Claudio Maria Villa
Publikováno v:
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0014880d2ce4883bc229cf8600070c7d
https://doi.org/10.1109/therminic52472.2021.9626532
https://doi.org/10.1109/therminic52472.2021.9626532
Autor:
Douglas Lodgson, Tom Quoc Lao, YiYi Ma, Marco Del, Nicolo' Manca, Roseanne Duca, Alex Gritti, David Cheng
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In the field of MEMS sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and mission profile, design and package technology need to be targeted in order to fit the best the giv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84d6a9f81cb2ff1232856fd97a3f9cfe
https://doi.org/10.1109/ectc32862.2020.00075
https://doi.org/10.1109/ectc32862.2020.00075
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Presence of sensor is relevant reality on all aspects of human life and based on the development of Internet of Things (IoT) in recent years the presence of sensors in our daily life is expected to continue increasing. The usability of a sensor in an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa87c571d7acfc30f5422912490de357
https://doi.org/10.1109/eptc47984.2019.9026616
https://doi.org/10.1109/eptc47984.2019.9026616
Autor:
Roseanne Duca
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Previous studies on the topic of warpage control during backend manufacturing have highlighted that controlling warpage is a challenge that needs to be tackled in early design stage. Failure to do so may result in later manufacturability or reliabili
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf07606bdec04d732ba154cc6f1ae0e3
https://doi.org/10.1109/eptc47984.2019.9026701
https://doi.org/10.1109/eptc47984.2019.9026701
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In the field of MEMS and sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and industrial domain, the design needs to be targeted toward the given requirements. The same sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4dc5ab693215601b80f93d9c4d2db18
https://doi.org/10.1109/itherm.2019.8757310
https://doi.org/10.1109/itherm.2019.8757310
Autor:
Roseanne Duca, Marco Omar Ghidoni
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Sensor technology has become relevant to all aspects of life. Sensors have become central to everyday applications related to safety, security, health and consumer leisure. Sensors are also significantly present in industrial applications such as pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e381e42197fa4d0eb1c62163b1c4f48
https://doi.org/10.1109/eurosime.2019.8724506
https://doi.org/10.1109/eurosime.2019.8724506
Autor:
Marco Rovitto, Claudio Maria Villa, Jing En Luan, Phone Maw Hla, Roseanne Duca, Arianna Morelli, Carlo Passagrilli
Publikováno v:
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Controlling warpage in backend manufacturing is a challenge that needs to be tackled in early design stage. Failure to do so may result in later manufacturability or reliability issues. This is of particular importance in BGA automotive packages wher
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdda451f73523b631f8cf3d2b1d0dff9
https://doi.org/10.1109/eptc.2018.8654402
https://doi.org/10.1109/eptc.2018.8654402
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Understanding and predicting warpage behavior during backend process is key to avoiding workability issues during manufacturing and later reliability issues during testing or during the device operational lifetime. To achieve this several challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54f2021fd5cecb21b260057075a7420f
https://doi.org/10.1109/eurosime.2018.8369877
https://doi.org/10.1109/eurosime.2018.8369877