Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Rongyan Sun"'
Autor:
Alasdair Mitchell, Xinyang Wei, Rongyan Sun, Kazuya Yamamura, Long Ye, Jonathan Corney, Nan Yu
Publikováno v:
Results in Engineering, Vol 24, Iss , Pp 103462- (2024)
Plasma processing presents complex behavioural characteristics that are created by different generation and processing methods. In this context, the digital twin (DT) method offers a visualisation and simulation techniques that enable better understa
Externí odkaz:
https://doaj.org/article/bcb2f75af218458392756ce2f5cdd193
Publikováno v:
Precision Engineering. 72:224-236
Slurry is widely used in polishing difficult-to-machine materials. However, it is accompanied with some issues, such as the agglomeration of abrasives and high disposal cost. Although using fixed abrasive grains instead of slurry can solve these issu
Publikováno v:
CIRP Annals. 69:301-304
Aluminum nitride (AlN) easily reacts with water when polished using an aqueous slurry. Moreover, grains tend to easily shed off of the AlN surface since it is a sintered material. Thus, obtaining a smooth AlN surface by traditional mechanical polishi
Autor:
Toru Fukano, Kentaro Kawai, Masanobu Kitada, Kazuya Yamamura, Xu Yang, Kenta Arima, Keiichiro Watanabe, Shiro Miyazaki, Rongyan Sun
Publikováno v:
Nanomanufacturing and Metrology. 2:168-176
Atmospheric-pressure plasma chemical vaporization machining (AP-PCVM) using helium as a carrier gas to achieve uniform thickness of quartz crystal wafers has been practically applied to the mass production of high-performance crystal units. However,
Publikováno v:
Nanomanufacturing and Metrology. 2:140-147
Single-crystal 4H–SiC is a promising next-generation semiconductor material for high-power and low-loss power devices. Electrochemical mechanical polishing (ECMP) is a very promising polishing technique for the manufacture of SiC wafers owing to it
Autor:
Nian Liu, Kentaro Sugimoto, Naoya Yoshitaka, Hideaki Yamada, Rongyan Sun, Kentaro Kawai, Kenta Arima, Kazuya Yamamura
Publikováno v:
Diamond and Related Materials. 124:108899
Publikováno v:
ACS Applied Materials & Interfaces. 11:2535-2542
Anodic oxidation is a promising surface modification technique for the manufacture of SiC wafers owing to its high oxidation rate. It is also possible to fabricate porous SiC by anodic oxidation and etching owing to the material properties of SiC. In
Autor:
Xu Yang, Kazuya Yamamura, Yuji Ohkubo, Kenta Arima, Kentaro Kawai, Rongyan Sun, Katsuyoshi Endo
Publikováno v:
Electrochimica Acta. 271:666-676
In an attempt to realize the high-quality and highly efficient polishing of SiC, the anodic oxidation mechanism of SiC was studied to enable the application of electrochemical mechanical polishing (ECMP). Through linear scanning voltammetry (LSV) and
Publikováno v:
Scientific Reports, Vol 8, Iss 1, Pp 1-9 (2018)
Scientific Reports
Scientific Reports
In recent years, reaction-sintered silicon carbide (RS-SiC) has been of interest in many engineering fields because of its excellent properties, such as its light weight, high rigidity, high heat conductance and low coefficient of thermal expansion.
Autor:
Rongyan Sun, Katsuyoshi Endo, Hideaki Yamada, K. Emori, Kazuya Yamamura, Y. Mokuno, Yuji Ohkubo, A. Chayahara
Publikováno v:
CIRP Annals. 67:353-356
Single-crystal diamond (SCD) is considered to be an ideal material for next-generation power devices. Plasma-assisted polishing (PAP) without using an abrasive was applied to polish SCD fabricated by chemical vapor deposition. Argon-based plasma cont