Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ronald Schöngrundner"'
Publikováno v:
Advances in Materials Science and Engineering, Vol 2015 (2015)
The present work investigates the residual stress formation and the evolution of phase fractions during the quenching process of cylindrical specimens of different sizes. The cylinders are made of hot-work tool steel grade X36CrMoV5-1. A phase transf
Externí odkaz:
https://doaj.org/article/4d52baa79d2641d8b48cb16cd0eb533e
Publikováno v:
Montanuniversität Leoben
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::a7fc8d990c5f618232d0a599661a73ec
https://puretest.unileoben.ac.at/portal/en/publications/comparison-of-different-methods-for-stress-and-deflection-analysis-in-embedded-die-packages-during-the-assembly-process(0a119ba7-5926-4937-a29e-8fcb4eb2f284).html
https://puretest.unileoben.ac.at/portal/en/publications/comparison-of-different-methods-for-stress-and-deflection-analysis-in-embedded-die-packages-during-the-assembly-process(0a119ba7-5926-4937-a29e-8fcb4eb2f284).html
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Autor:
Katerina Macurova, Paul Angerer, Thomas Antretter, raul bermejo, Wilson Maia, Ronald Schöngrundner, Thomas Krivec, Mike Morianz, Michel Brizoux
Publikováno v:
Montanuniversität Leoben
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::1a823fce288ad079791fd991c780df29
https://pure.unileoben.ac.at/portal/en/publications/simulation-of-stress-distribution-in-assembled-silicon-dies-and-deflection-of-printed-circuit-boards(8b1c08ba-b16d-486c-932a-f403b60810a1).html
https://pure.unileoben.ac.at/portal/en/publications/simulation-of-stress-distribution-in-assembled-silicon-dies-and-deflection-of-printed-circuit-boards(8b1c08ba-b16d-486c-932a-f403b60810a1).html