Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Ronald R. Hylton"'
Autor:
Ronald R. Hylton
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper describes the electrical signatures and failure analysis techniques used to identify plastic encapsulated devices that have failed due to silver migration. This migration, which produces resistive leakages between adjacent pins, has been a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::34a846f1297e40ba97ca8e05d6869431
https://doi.org/10.31399/asm.cp.istfa2008p0112
https://doi.org/10.31399/asm.cp.istfa2008p0112
Autor:
Ronald R. Hylton
Publikováno v:
International Symposium for Testing and Failure Analysis.
In situ decapsulation of plastic devices can be used to avoid the removal or alteration of failure mechanisms caused by exposure to desoldering temperatures. This paper describes techniques to decapsulate devices mounted to a printed circuit board us
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::514169df31499a018b559d07730fdca0
https://doi.org/10.31399/asm.cp.istfa2002p0333
https://doi.org/10.31399/asm.cp.istfa2002p0333
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detec
