Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Ronald L. Akau"'
Autor:
Amanda B. Dodd, Roy E. Hogan, Leslie M. Phinney, Ronald L. Akau, Flint Pierce, John Tencer, Alexander L. Brown, Dean Dobranich, Tolulope O. Okusanya
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1600d1f29cc6b6e14ec123b8599038e3
https://doi.org/10.2172/1561501
https://doi.org/10.2172/1561501
Publikováno v:
Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles.
Thermal interface materials (TIMs) serve a critical role in thermal management by enhancing heat transfer across contact interfaces. Specifically, they are most commonly used in electronics to enhance the flow of heat from source to sink by decreasin
Autor:
R. Rex Kay, Steven C. Bender, Tammy D. Henson, Donald A. Byrd, Jeffrey L. Rienstra, Max L. Decker, N G. Rackley, Ronald L. Akau, John P. Claassen, Ronald E. Kidner, Richard B. Taplin, David M. Bullington, Kevin D. Marbach, Chris E. Lanes, Cynthia K. Little, Barham W. Smith, Brian C. Brock, Paul G. Weber
Publikováno v:
SPIE Proceedings.
MTI is a comprehensive research and development project that includes up-front modeling and analysis, satellite system design, fabrication, assembly and testing, on-orbit operations, and experimentation and data analysis. The satellite is designed to
Applications of high thermally conductive K1100X/resin systems to spacecraft structure and equipment
Autor:
Gary C. Krumweide, Ronald L. Akau
Publikováno v:
AIP Conference Proceedings.
During the last few years, the potential applications of highly conductive polymer composites to spacecraft structures and equipment has received great interest. Amoco’s K1100X fiber is currently the only fiber available that, in a practical lamina
Autor:
William H. Greenwood, Ronald L. Akau
Publikováno v:
AIP Conference Proceedings.
A five watt pseudo chip in the middle of a SEM-X circuit card was tested with various heat conduction paths in a satellite type electronic box while mounted in a vacuum chamber. Previous tests showed low temperature differentials with the use of circ
Conference
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