Zobrazeno 1 - 10
of 47
pro vyhledávání: '"Ronald J. Warzoha"'
Autor:
Enrique D. Gomez, Zhe Chen, Tian Zhang, Seong H. Kim, Bing Zhang, Ziyu Liu, Wengchang Lu, Ronald J. Warzoha, Jerry Bernholc, Xin Chen, Qiyan Zhang, Qiming Zhang, Brian F. Donovan
Publikováno v:
Matter. 4:2448-2459
Summary Polymers with high dielectric breakdown strength (Eb) over a broad temperature range are vital for many applications. The presence of weak points, such as voids and free volume, severely limit the Eb of many high-temperature polymers. Here, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a40e0cee9102ac92c4c2f85c2d8f40f3
https://doi.org/10.1016/j.matt.2021.04.026
https://doi.org/10.1016/j.matt.2021.04.026
Autor:
Ronald J. Warzoha
Publikováno v:
ASME 2022 Heat Transfer Summer Conference.
Theremoreflectance techniques that utilize a fiber-based probe have obvious advantages for characterizing the thermal properties of liquids and biological materials. For instance, an all-fiber thermoreflectance system would allow for its integration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0df7e0900574e7697441df37a0117cc1
https://doi.org/10.1115/ht2022-80540
https://doi.org/10.1115/ht2022-80540
Autor:
Edward P. Gorzkowski, Ashutosh Giri, Tyler Cosby, Ronald J. Warzoha, Adam A. Wilson, Andrew J. Borgdorff, Nicholas T. Vu, Eric A. Patterson, Brian F. Donovan
Publikováno v:
Macromolecules. 53:11089-11097
Thin-film (5–20 μm) polymer dielectrics are a critical component in high energy density capacitors. Understanding thermal transport in these materials is critical to addressing thermally enabled di...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e6a43c2b9357de324ee911205c9f217
https://doi.org/10.1021/acs.macromol.0c01243
https://doi.org/10.1021/acs.macromol.0c01243
Autor:
Brian F. Donovan, Ronald J. Warzoha
Publikováno v:
Physical review letters. 128(12)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9672d26fabc47b5f9a46cd7f8c6fdeb5
https://pubmed.ncbi.nlm.nih.gov/32142352
https://pubmed.ncbi.nlm.nih.gov/32142352
Publikováno v:
Journal of Electronic Packaging. 143
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f60d3a3db7ea9e8fe7c5f8acf27a2b8b
https://doi.org/10.1115/1.4052174
https://doi.org/10.1115/1.4052174
Publikováno v:
International Journal of Heat and Mass Transfer. 130:874-881
Interfaces play a critical role in heat dissipation for electronics packaging applications, thermoelectric energy conversion, data center cooling and renewable energy systems architectures. They are particularly influential as device length scales ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::767ac45b59642b40bbbcdbd9fe7d518e
https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099
https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099
Publikováno v:
Review of Scientific Instruments. 93:084904
Time delayed pump–probe measurement techniques, such as Time Domain Thermoreflectance (TDTR), have opened up a wealth of opportunities for metrology at ultra-fast timescales and nanometer length scales. For nanoscale thermal transport measurements,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::389e898657580f54508f69a79502bc61
https://doi.org/10.1063/5.0089075
https://doi.org/10.1063/5.0089075
Autor:
Ronald J. Warzoha
Publikováno v:
Journal of Electronic Packaging. 143
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20e996eb3786e03de05fc2a3ca8cb9c9
https://doi.org/10.1115/1.4050407
https://doi.org/10.1115/1.4050407
Autor:
Adam A. Wilson, Samuel Graham, Ronald J. Warzoha, Patrick E. Hopkins, Darshan G. Pahinkar, Zhiting Tian, Brian F. Donovan, Sukwon Choi, Laura B. Ruppalt, Nazli Donmezer, Ashutosh Giri, Jingjing Shi
Publikováno v:
Journal of Electronic Packaging. 143
This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hiera
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e25ce67d00d927182c45f72416a6ea31
https://doi.org/10.1115/1.4049293
https://doi.org/10.1115/1.4049293
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thermal resistance arises at the interface of two different materials. However, developers of sensors, electronics, and power conversion devices often ignore this effect. The additional thermal resistance imposed due to interface can enhance sensitiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cddd16e1f3348f35b543cc0c717c4251
https://doi.org/10.1109/itherm45881.2020.9190379
https://doi.org/10.1109/itherm45881.2020.9190379