Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Ronald A. Carpio"'
Publikováno v:
Microelectronic Engineering. 35:169-174
This paper describes the use of two step post-exposure-bakes for improving the lithographic performance of the chemically amplified resist, UVIIHS TM from the Shipley Company. With this process, post-exposure-baking at a low temperature allows the de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c6d451e6c44664bcb6ec5bddd8c6bb7
https://doi.org/10.1016/s0167-9317(96)00086-x
https://doi.org/10.1016/s0167-9317(96)00086-x
Publikováno v:
Journal of Photopolymer Science and Technology. 10:425-443
This paper will report post-exposure delay results using Shipley UVIBISTM deep UV resist. The variables of the experiments include: processing delays (expose to post-exposure-bake and coat to exposure), different levels of ammonia, different substrat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::674c462479a7bbb83b45c942b30758d0
https://doi.org/10.2494/photopolymer.10.425
https://doi.org/10.2494/photopolymer.10.425
Publikováno v:
Thin Solid Films. 280:37-42
Specular X-ray reflectivity from SiO2 thin films prepared on silicon substrates by plasma-enhanced chemical vapor deposition showed the films to have a characteristic width of the decay in density at the free surface of 17 A, to be about three-quarte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4894f3de565dc02d79a251e127210029
https://doi.org/10.1016/0040-6090(95)08178-x
https://doi.org/10.1016/0040-6090(95)08178-x
Publikováno v:
Thin Solid Films. 266:238-244
Chemical mechanical polishing (CMP) of copper has been investigated with suspended silica and alumina abrasives using various slurry chemistries. The characteristics of these chemistries were studied by electrochemical d.c. polarization and a.c. impe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e14dfd81ef6b66f8c9f74f930b0fbdc
https://doi.org/10.1016/0040-6090(95)06649-7
https://doi.org/10.1016/0040-6090(95)06649-7
Autor:
Georgia K. Rich, Daniel Miller, John L. Sturtevant, Kim Dean, John S. Petersen, Ronald A. Carpio, Theodore H. Fedynyshyn, James W. Thackeray
Publikováno v:
Journal of Photopolymer Science and Technology. 8:571-597
Current efforts to reduce deep ultraviolet (DUV) photoresist profile abnormalities on silicon nitride (Si3N4) and titanium nitride (TiN) are summarized. The nitridic surface of the films is investigated to understand the mechanism that is responsible
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bb3bf9ea48d5fe71c70849e1052eeea
https://doi.org/10.2494/photopolymer.8.571
https://doi.org/10.2494/photopolymer.8.571
Publikováno v:
Journal of Chromatography A. 657:185-191
Method development and applications of capillary electrophoresis to the analysis of cations in highest purity grades of hydrogen peroxide which are used for semiconductor processing are discussed. Indirect UV detection in conjunction with electromigr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3b27971d010a8e5a32b2fe25fed2658
https://doi.org/10.1016/0021-9673(93)83050-3
https://doi.org/10.1016/0021-9673(93)83050-3
Publikováno v:
Analytical Chemistry. 64:2123-2129
The application of the new technique of electrophoretic capillary ion analysis (CIA) to the analysis of borophosphosilicate thin films (BPSG) is described. CIA and ion chromatography (IC) were shown to produce equivalent analytical results for boron,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d71679d10e5a82c683bfcbf745cee04
https://doi.org/10.1021/ac00042a017
https://doi.org/10.1021/ac00042a017
A new optical technique for monitoring wafer curvature and stress during copper damascene processing
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XVIII.
Initial characterization of the damascene process was obtained with the new coherent gradient sensing (CGS) interferometer on 200 and 300 mm wafers. The current study represents an extension of earlier work by taking advantage of the greater spatial
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e73707f4a1259a97797275509d1fcf76
https://doi.org/10.1117/12.537536
https://doi.org/10.1117/12.537536
Publikováno v:
SPIE Proceedings.
A special UV curing process which employs an ammonia blanketing gas was investigated to determine if a reduction in chemically amplified photoresist loss cold be attained in oxide, polysilicon, and metal plasma etch processes. In addition, a reductio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab3fc052c0862a9d50d17edfe15fe3da
https://doi.org/10.1117/12.350145
https://doi.org/10.1117/12.350145
Publikováno v:
MRS Proceedings. 562
Copper electroplating has become the leading technology for gap fill of damascene structures on advanced interconnects. A key to developing a robust electroplating process that produces deposits free of voids and seams is understanding the role of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16331e1d489395b11ad24cc13d009cd1
https://doi.org/10.1557/proc-562-235
https://doi.org/10.1557/proc-562-235