Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Ron Huemoeller"'
Autor:
Michael G. Kelly, SangHyoun Lee, Ron Huemoeller, JinYoung Khim, WonChul Do, YoungDo Kweon, KwangSeok Oh, HyunHye Jung, MiKyeong Choi, DongSu Ryu, KyungRok Park
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf839f67332bf5d634c8a2fe71f36fc0
https://doi.org/10.1109/ectc32862.2020.00211
https://doi.org/10.1109/ectc32862.2020.00211
Autor:
Ron Huemoeller
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-53
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::457e1f92efe6d7652d4f231c8b39b764
https://doi.org/10.4071/2017dpc-keynote1_huemoeller
https://doi.org/10.4071/2017dpc-keynote1_huemoeller
Autor:
Curtis Zwenger, Ron Huemoeller
Publikováno v:
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
The continued scaling of transistor geometries for semiconductor devices has been placing an increased demand on the next‐level interconnect technologies. A new, innovative chip‐last high density fan‐out (HD‐FO) structure called Silicon Wafer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6f1715e84786b295542be814cb5a6a4
https://doi.org/10.1002/9781119313991.ch7
https://doi.org/10.1002/9781119313991.ch7
Autor:
Ron Huemoeller
Publikováno v:
International Symposium on Microelectronics. 2016:S1-S46
Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In fact, the overall packaging industry is doing quite well today as a result, with solid growt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6478b61d71edaa80327955fb369a6ecd
https://doi.org/10.4071/isom-2016-slide-1
https://doi.org/10.4071/isom-2016-slide-1
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000567-000590
New system level IC package integration requires a flexible assembly portfolio. A review of current wafer scale processing and assembly solutions and new development directions is warranted. 2.5D TSV System level IC packaging is not new, but the perf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2dcf19eaad8e0d08dae81594693ae7a
https://doi.org/10.4071/2016dpc-tp11
https://doi.org/10.4071/2016dpc-tp11
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000217-000247
The tremendous growth in the mobile handset, tablet, and networking markets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::362cfcf292f221e106d76bcaa73e160e
https://doi.org/10.4071/2015dpc-ta22
https://doi.org/10.4071/2015dpc-ta22
Autor:
KwangSeok Oh, Jemmy Sutanto, Juhoon Yoon, Robert Lanzone, Ron Huemoeller, DaeByoung Kang, Michael Oh
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000916-000936
This paper describes the ongoing 3 years research and development at Amkor Technology on CoC (Chip on Chip)/FtF (Face to Face) – PossumTM technology. This technology has showed a lot of interests from the microelectronics customers/industries becau
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c29481ac48c48ba17e16e84d0555ae9b
https://doi.org/10.4071/2013dpc-tp33
https://doi.org/10.4071/2013dpc-tp33
Autor:
Ron Huemoeller
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000334-000346
The market has narrowed its approach and solidified its direction for the majority of 2.5 and 3D TSV product technologies. Forecasts have now become real for these technologies and the end game realized as evidenced by production launch of the Xilinx
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fdae6d5bae9207f07cc5c9fa31e3f9a
https://doi.org/10.4071/2012dpc-ta11
https://doi.org/10.4071/2012dpc-ta11
Autor:
MinJae Lee, Riko Radojcic, KeunSoo Kim, Sam Gu, David Jon Hiner, Michael G. Kelly, Seokgeun Ahn, Hwankyu Kim, DaeByoung Kang, Dong Wook Kim, Ron Huemoeller
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Advanced chip on wafer (CoW) assembly has emerged as a key assembly technology for enabling advanced silicon nodes and complex integration. Traditional assembly methods for chip attach have proven capable in this approach, but suffer in the area of f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::058f82acff2c0d5bf40f2ad8f4cbe4aa
https://doi.org/10.1109/ectc.2015.7159565
https://doi.org/10.1109/ectc.2015.7159565
Autor:
KwangSeok Oh, DaeByoung Kang, Robert Lanzone, KyungRok Park, S. Y. Ma, Michael Oh, Juhoon Yoon, Ron Huemoeller, J. Sutanto
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper describes the ongoing research and development at Amkor Technology of Chip-on-chip/Face to Face (CoC/F2F) technology being developed in parallel with Through Silicon Via (TSV) package assembly. Unlike other 3D packaging techniques using TS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7197b8218e99dfda72e1dff6237674e
https://doi.org/10.1109/ectc.2013.6575690
https://doi.org/10.1109/ectc.2013.6575690