Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Romina Sattari"'
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d26bb254a02ff2096df9915fde029763
https://doi.org/10.1109/eurosime56861.2023.10100771
https://doi.org/10.1109/eurosime56861.2023.10100771
Publikováno v:
Applied Thermal Engineering. 221
The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2516dba23b3e208506fcbb302e752398
https://doi.org/10.1016/j.applthermaleng.2022.119503
https://doi.org/10.1016/j.applthermaleng.2022.119503
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Proceedings
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
This paper focuses on the design and fabrication of a new programmable thermal test chip as a flexible and cost-effective solution for simplification of characterization/prototyping of new packages. The cell-based design format makes the chip fit int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::48a057b27323912b0a5e1e85a7b63dfd
https://doi.org/10.23919/empc53418.2021.9584984
https://doi.org/10.23919/empc53418.2021.9584984